News Center-Changsha Saneway Electronic Materials Co., Ltd.

Changsha Sublimation Microelectronics Material Co., Ltd.

Company News

At the 27th China International Optoelectronics Expo, Changsha Shenghua Microelectronics is driving the rapid growth of the optoelectronics industry with its core heat-sink materials.

On September 11, the three-day 27th China International Optoelectronics Expo (CIOE 2026) officially came to a close at the Shenzhen International Convention and Exhibition Center.

Release time:

2026-09-15

Dual Cities, Dual Exhibitions: A Bold Showcase | Shenghua Microelectronics Debuts Its Latest Products at Two Major Industry Events in Shanghai and Shenzhen!

From June 10 to 12, 2026, Changsha Shenghua Microelectronic Materials Co., Ltd. (referred to as “Shenghua Microelectronics”) will make a simultaneous appearance at two of the industry’s premier trade shows: the 2026 Future Industries New Materials Expo in Shanghai and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in Shenzhen. The company will showcase its core electronic packaging thermal management materials—such as tungsten‑copper, molybdenum‑copper, and diamond‑copper—highlighting its robust technological capabilities and driving innovation across cutting-edge sectors including semiconductors, data centers, and AI computing power.

Release time:

2026-06-10

Changsha Shenghua Microelectronics Shines at PCIM Asia 2025 Shanghai Exhibition: Empowering the Future of Power Electronics with High-Performance Materials

From September 24 to 26, 2025, PCIM Asia Shanghai, the premier event in Asia’s power electronics industry—a leading international exhibition and conference on power components and renewable energy management—will be held grandly at Halls N4 and N5 of the Shanghai New International Expo Center.

Release time:

2025-09-28

2025 Shanghai PCIM: Shenghua Microelectronics looks forward to your visit!

Release time:

2025-07-05

Explore the future of chips, and together build the dream of materials science! Central South University's materials students successfully concluded their 2025 Ascension Internship Program!

In the scorching heat of July, enthusiasm was blazing! On July 4, Changsha Shenghua Microelectronics Materials Co., Ltd. welcomed a vibrant group of visitors—students from the Class of 2023 at the School of Materials Science and Engineering, Central South University! Filled with a deep passion for materials science and an unwavering desire for hands-on industry experience, they stepped into Shenghua, embarking on an immersive internship journey.

Release time:

2025-07-04

Changsha Shenghua Microelectronics Materials Co., Ltd. shines at the 2025 China Optoelectronics Expo in Shenzhen, leveraging high-performance electronic packaging materials to empower a new future for the optoelectronics industry.

From September 10 to 12, 2025, the 26th China International Optoelectronics Expo (CIOE)—China Optics Fair—bustled to life at the Shenzhen International Convention and Exhibition Center. As the largest and most influential industry event in the global optoelectronics sector, this year’s expo drew over 3,800 high-quality optoelectronic companies from around the world, spanning all eight core areas of the optoelectronics industry chain.

Release time:

2025-09-15

Industry News

What is molybdenum-copper alloy?

Molybdenum-copper alloy is a material that can be used as an alternative to copper and tungsten-copper applications. It is made from high-quality molybdenum powder and oxygen-free copper powder, and is formed using isostatic pressing (high-temperature sintering-copper infiltration). The material has a fine and dense structure, excellent arc-breaking performance, good electrical conductivity, good thermal conductivity, and low thermal expansion.

2023

Characteristics of tungsten-copper?

Resistance welding electrode: It combines the advantages of tungsten and copper, featuring high temperature resistance, arc erosion resistance, high strength, high specific gravity, good electrical and thermal conductivity, easy machining, and sweating cooling characteristics. Due to its high hardness, high melting point, and anti-adhesion properties of tungsten, it is often used as a wear-resistant and high-temperature resistant projection welding and butt welding electrode.

2023

What is tungsten-copper?

Tungsten-copper refers to an alloy composed of tungsten and copper, with a common copper content ranging from 10% to 50%. The alloy is produced using powder metallurgy methods and exhibits excellent electrical and thermal conductivity, good high-temperature strength, and a certain degree of plasticity. At very high temperatures, such as above 3000°C, the copper in the alloy is liquefied and evaporated, absorbing a large amount of heat and reducing the surface temperature of the material. Therefore, this type of material is also known as a metal sweating material.

2023

What are the key performance parameters of heat sink materials?

The key coefficients of heat sink materials include density, thermal expansion coefficient, and thermal conductivity.

2023

What is the heat sink method in LED packaging?

The term "heat sink" refers to heat dissipation. Therefore, the purpose of using a heat sink in LED packaging is to add heat dissipation fins or increase the contact area on one junction surface of the LED, in order to achieve effective heat dissipation.

2023

What is the difference between a heat exchanger and a heat sink?

In industrial applications, a heat sink typically refers to a miniature cooling device used to cool electronic chips. On the other hand, a heat exchanger is a device designed to transfer heat from a hot fluid to a cold fluid, meeting specific process requirements.

2023

What is a heat sink?

A heat sink refers to an object whose temperature remains constant despite the amount of heat energy transferred to it. It can be anything from the atmosphere to the ground.

2023

Are heat sink materials and electronic packaging materials the same concept?

No, they are not the same concept. Heat sink materials are specifically designed for use as heat sinks, while electronic packaging materials encompass a much broader range of materials, making it a larger concept. Some heat sink materials can be used for electronic packaging, but not all of them.

2023

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