Changsha Shenghua Microelectronics Materials Co., Ltd. shines at the 2025 China Optoelectronics Expo in Shenzhen, leveraging high-performance electronic packaging materials to empower a new future for the optoelectronics industry.

From September 10 to 12, 2025, the 26th China International Optoelectronics Expo (CIOE)—China Optics Fair—bustled to life at the Shenzhen International Convention and Exhibition Center. As the largest and most influential industry event in the global optoelectronics sector, this year’s expo drew over 3,800 high-quality optoelectronic companies from around the world, spanning all eight core areas of the optoelectronics industry chain.

From September 10 to 12, 2025, the 26th China International Optoelectronics Expo (CIOE) kicked off spectacularly at the Shenzhen International Convention and Exhibition Center. As the largest and most influential industry event in the global optoelectronics sector, this year’s expo drew more than 3,800 high-quality optoelectronic companies from around the world, spanning all eight core areas of the optoelectronics industry chain.

Changsha Shenghua Microelectronics Materials Co., Ltd. has been deeply rooted in the field of high-performance electronic packaging materials for many years, focusing on providing critical material solutions for cutting-edge industries such as microwave RF, optical communications, semiconductor lasers, and power semiconductors. At this grand event where technology seamlessly merges with industry, Changsha Shenghua Microelectronics Materials Co., Ltd. proudly unveiled its latest R&D breakthroughs—tungsten-copper, molybdenum-copper, CPC, CMC, and diamond-copper composite materials—capturing significant attention as one of the highlights in the optoelectronics innovation zone.

Tungsten-copper/Molybdenum-copper composite material

To address the thermal management needs in high-power-density applications, the company has developed tungsten-copper and molybdenum-copper materials that boast thermal conductivity exceeding 200 W/m·K—more than three times higher than traditional materials. Notably, the molybdenum-copper material boasts a lower density than tungsten-copper, offering both lightweight properties and exceptional thermal performance. These advanced materials have already been widely adopted in applications such as automotive LiDAR systems and 5G base stations, helping to miniaturize devices while enhancing their reliability.

CPC (Copper/Molybdenum Copper/Copper) and other composite materials

As the preferred material for ceramic package substrates, CPC material achieves precise thermal expansion coefficient matching through its innovative "sandwich" structural design. It also boasts a 20% improvement in thermal conductivity compared to conventional CMC materials, along with advantages such as easy stamping and forming, and exceptional resistance to high-temperature shocks up to 850°C. This material has already been validated by companies like Changdian Technology and Tongfu Microelectronics, making it ideal for advanced packaging applications—including AI chips and IGBT power modules.

Diamond-copper composite material

The company’s newly developed diamond-copper composite material combines diamond’s exceptional thermal conductivity with copper’s excellent machinability, achieving a thermal conductivity exceeding 600 W/m·K. This breakthrough makes it the "ultimate solution" for next-generation high-performance computing chip cooling—specifically designed to tackle the heat dissipation challenges plaguing AI servers.

Changsha Shenghua Microelectronics Materials Co., Ltd., a national "Little Giant" enterprise specializing in niche and innovative technologies, has been deeply rooted in the field of optoelectronic materials. The company's products are widely used in areas such as 5G communications, semiconductors, smart automobiles, and consumer electronics, serving over 300 global customers.

The 2025 China Optoelectronics Expo in Shenzhen has successfully concluded, but the wave of innovation in the optoelectronics industry shows no signs of slowing down. Changsha Shenghua Microelectronics Materials Co., Ltd. will take this exhibition as a fresh starting point to continuously push the boundaries of materials technology, working hand-in-hand with partners across the industry chain to jointly craft the grand vision of "Illuminating the Future"!

From September 24 to 26, 2025, Changsha Shenghua Microelectronics Materials Co., Ltd. will showcase its latest achievements at the PCIM Exhibition in Shanghai—stay tuned!

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