Industry News_Changsha Saneway Electronic Materials Co., Ltd.

Changsha Sublimation Microelectronics Material Co., Ltd.

Introduction of high-activity composite powder products

Our company has prepared a kind of high-activity composite powder through the spray granulation method, which is characterized by its extremely high sintering shrinkage performance. It is often used in the production of thermal sink materials with large differences in melting points, such as tungsten-copper and molybdenum-copper metal powder mixed powder billet pressing, injection molding and other production processes.

2023

Traditional Packaging Materials

Metal packaging materials are the earliest developed packaging materials, known for their high thermal conductivity, mechanical strength, good processing performance, and electromagnetic shielding effects. Traditional metal packaging materials primarily include Cu, Al, W, Mo, as well as Kovar alloy (Fe-Co-Ni alloy) and Invar alloy (Fe-Ni alloy). Cu and Al exhibit high thermal conductivity and excellent heat dissipation performance, but their high thermal expansion coefficients make it difficult to match with silicon wafers. Thermal cycling generated by the chip during operation can cause significant stress. Additionally, Cu has a relatively high density. Kovar alloy and Invar alloy have thermal expansion coefficients that match silicon wafers well, but their lower thermal conductivity can significantly impact the performance of highly integrated packaging devices. Compared to Al, these materials have higher densities and inferior stiffness. W and Mo offer improved thermal conductivity compared to Kovar and Invar alloys, along with lower thermal expansion coefficients. However, their poor wettability with silicon wafers requires the application of Ag or Ni coatings, increasing process complexity and costs. Their higher densities also limit their use in aerospace applications.

2023

Preparation method of metal matrix composite electronic packaging material

This method encompasses gas pressure infiltration casting, squeeze casting, and pressure-free infiltration casting. Gas pressure infiltration casting utilizes gas to transmit pressure, pressing the molten metal into the preform to obtain a composite material. Preforms can be made through common pressing, slurry casting, and injection molding methods. This method is highly effective for producing electronic packaging materials, achieving composite materials with added particle volume percentages ranging from 50% to 80%. However, it has the disadvantages of a slower production process and lower applied pressure. Squeeze casting involves making the reinforcement into a preform, placing the preform in a mold, and infiltrating the molten metal into the reinforcement preform through liquid pressure. Although there may be some residual gas in the produced electronic packaging material, the material quality is good, with the advantages of a short production cycle and mass production capabilities. The disadvantages include higher production costs, high requirements for infiltration pressure and molds, and significant limitations on the complexity of part shapes. The manufacturing process for pressure-free infiltration casting involves placing the matrix alloy ingot onto the preform, introducing a controlled atmosphere containing N2, and heating until the alloy melts and spontaneously infiltrates into the preform. The advantages include the ability to vary the amount of Si CP as needed, lower production costs, and the ability to produce complex grid-like electronic packaging materials. The main disadvantages are that it must be performed in a controlled N2 atmosphere, certain areas of the preform may not be fully infiltrated, there may be a certain amount of porosity in the product, and the production process takes a longer time.

2023

The main performance requirements of electronic packaging materials

Encapsulation materials play a role in supporting and protecting semiconductor chips and electronic circuits, as well as assisting in the dissipation of heat generated during circuit operation.

2023

Performance and Application of Tungsten-Copper Composite Materials

Tungsten boasts high melting point, high density, low coefficient of thermal expansion, and high strength, while copper exhibits excellent thermal conductivity and electrical conductivity. The W-Cu composite material, composed of tungsten and copper, combines the advantages of both W and Cu, such as high high-temperature strength, high electrical and thermal conductivity, good electrical erosion resistance, high hardness, low coefficient of thermal expansion, and certain plasticity. Furthermore, by adjusting its composition ratio, its various mechanical and physical properties can be controlled and optimized. Additionally, it possesses novel properties arising from the combination of tungsten and copper, such as self-cooling due to the heat absorption through evaporation of the copper content under high-temperature conditions. Therefore, it finds widespread applications in various industrial sectors such as aerospace, electronics, machinery, and electrical appliances, especially in high-tech fields.

2023

Performance of Tungsten-Copper and Molybdenum-Copper Materials for Electronic Packaging

WCu and MoCu alloys are primarily used in large-scale integrated circuits and high-power microwave devices as insulating metal substrates, thermal control plates, heat dissipation components (heat sink materials), and lead frames. For electronic packaging materials, their quality and performance must meet extremely high requirements. Not only do they require high purity and air tightness (high density), low gas content, and uniform micro structure, but they also demand high thermal conductivity and a thermal expansion coefficient that matches the chip.

2023

Composite Materials for Electronic Packaging

Composite materials are composed of two or more different materials, which can have the comprehensive properties of different materials. At present, there are three main types of composite materials in the field of electronic packaging.

2023

Heat-conducting material

Heat conductive materials are a new type of industrial materials designed in recent years to meet the heat transfer requirements of equipment, with excellent and reliable performance. They are suitable for various environments and requirements, and have proper countermeasures for possible heat conduction problems. They provide powerful support for the high integration and ultra-small and ultra-thin design of equipment. This heat conductive product has been increasingly applied to many products, improving the reliability of the products.

2023

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Contact Information

Sales Hotline：0731-83978608

Phone：18817146090(Same number on WeChat)
E-mail：junzhou@saneway.com

Enterprise address: No. 435, Section 3, jinzhou Avenue, Ningxiang High-tech Zone, Changsha

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