The main performance requirements of electronic packaging materials

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Encapsulation materials play a role in supporting and protecting semiconductor chips and electronic circuits, as well as assisting in the dissipation of heat generated during circuit operation.

As ideal electronic encapsulation materials, they must meet the following basic requirements:

① Low coefficient of thermal expansion;

② Good thermal conductivity;

③ Good air tightness, able to resist the impact of harmful environments such as high temperature, high humidity, corrosion, and radiation on electronic devices;

④ High strength and stiffness, supporting and protecting the chip;

⑤ Good processing, molding, and welding performance, facilitating the processing into various complex shapes;

⑥ For electronic encapsulation materials used in the aerospace field and other portable electronic devices, the density requirement is as small as possible to reduce the weight of the device.