Changsha Sublimation Microelectronics Material Co., Ltd.

About Us

Development Process

In the future

Products will continue to innovate, providing customers with more technical services they need

2023

The construction project of annual output of 30 million electronic packaging materials was officially put into operation

2022

The company has developed COB tungsten copper products and won the honorary title of "Country Province Specialized, Expert, Unique and New Little Giant Enterprise". The R&D center has won the honorary title of "Hunan Province Enterprise Technology Center"

2021

Changde Saneway Metal Surface Treatment Co., Ltd. was founded and changsha tengchuang was mergered, steadily increasing market share

2020

The company has successfully restructured and deepen reform nickel plating technology on the surface of heat sink materials, solving the problem of poor soldering of chip carriers. The nickel plating process has been improved and optimized

2015

Diamond-copper, KCK and other products have been successfully developed

2013

The company moved to Ningxiang base

2007

Independently develop processing technology while improving industrial chain and surface treatment technology of electronic packaging materials

2002

Develop molybdenum copper, CMC (Cu/Mo/Cu) and CPC (Cu/MoCu/Cu) products

2000

Incorporation of the company

1999

Develop tungsten copper electronic packaging materials