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Preparation method of metal matrix composite electronic packaging material

This method encompasses gas pressure infiltration casting, squeeze casting, and pressure-free infiltration casting. Gas pressure infiltration casting utilizes gas to transmit pressure, pressing the molten metal into the preform to obtain a composite material. Preforms can be made through common pressing, slurry casting, and injection molding methods. This method is highly effective for producing electronic packaging materials, achieving composite materials with added particle volume percentages ranging from 50% to 80%. However, it has the disadvantages of a slower production process and lower applied pressure. Squeeze casting involves making the reinforcement into a preform, placing the preform in a mold, and infiltrating the molten metal into the reinforcement preform through liquid pressure. Although there may be some residual gas in the produced electronic packaging material, the material quality is good, with the advantages of a short production cycle and mass production capabilities. The disadvantages include higher production costs, high requirements for infiltration pressure and molds, and significant limitations on the complexity of part shapes. The manufacturing process for pressure-free infiltration casting involves placing the matrix alloy ingot onto the preform, introducing a controlled atmosphere containing N2, and heating until the alloy melts and spontaneously infiltrates into the preform. The advantages include the ability to vary the amount of Si CP as needed, lower production costs, and the ability to produce complex grid-like electronic packaging materials. The main disadvantages are that it must be performed in a controlled N2 atmosphere, certain areas of the preform may not be fully infiltrated, there may be a certain amount of porosity in the product, and the production process takes a longer time.