Dual Cities, Dual Exhibitions: A Bold Showcase | Shenghua Microelectronics Debuts Its Latest Products at Two Major Industry Events in Shanghai and Shenzhen!

From June 10 to 12, 2026, Changsha Shenghua Microelectronic Materials Co., Ltd. (referred to as “Shenghua Microelectronics”) will make a simultaneous appearance at two of the industry’s premier trade shows: the 2026 Future Industries New Materials Expo in Shanghai and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in Shenzhen. The company will showcase its core electronic packaging thermal management materials—such as tungsten‑copper, molybdenum‑copper, and diamond‑copper—highlighting its robust technological capabilities and driving innovation across cutting-edge sectors including semiconductors, data centers, and AI computing power.

From June 10 to 12, 2026, Changsha Shenghua Microelectronics Materials Co., Ltd. (hereinafter referred to as “Shenghua Microelectronics”) will simultaneously participate in two of the industry’s premier trade shows, namely: 2026 Future Industries New Materials Expo (Shanghai) and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition (Shenzhen) , making a high‑profile debut with core electronic packaging thermal management materials such as tungsten‑copper, molybdenum‑copper, and diamond‑copper, leveraging cutting‑edge technological prowess to power前沿 industries like semiconductors, data centers, and AI computing!

As National-level Specialized, Refined, Distinctive, and Innovative “Little Giant” Enterprise For more than two decades, Shenghua Microelectronics has been deeply engaged in the field of electronic packaging materials. Leveraging the industry–university–research collaboration strengths of Central South University, the company has established a domestically leading and internationally advanced R&D and manufacturing system. At this year’s Shanghai and Shenzhen exhibitions, the company is highlighting a range of core products, including tungsten‑copper, molybdenum‑copper, and diamond‑copper composite materials.

- ✅ Tungsten-copper material (WCu): High thermal conductivity, high strength, and a controllable coefficient of thermal expansion, making it well-suited for high-power thermal management applications such as microwave and RF systems, and power semiconductors.

- ✅ Molybdenum–copper material (MoCu): Combines lightweight design with high thermal conductivity, boasting a thermal conductivity exceeding 200 W/m·K, and is widely used in applications such as 5G base stations and automotive LiDAR systems.

- ✅ Diamond Cu material: With a thermal conductivity exceeding 800 W/m·K, it represents the “ultimate solution” for heat dissipation in AI servers and high-performance computing chips, completely overcoming the bottleneck of high-density cooling.

With the explosive growth of large AI models driving a surge in computing power demand, Shenghua Microelectronics is spotlighting data center and AI server cooling applications at this year’s Shenzhen exhibition, highlighting high-performance thermal management materials tailored for liquid-cooling systems and high-power chip packaging.

- Tungsten–copper and molybdenum–copper heat sink materials compatible with both cold‑plate and immersion liquid‑cooling solutions, balancing high thermal conductivity with structural stability;

- Diamond‑copper thermal materials for high‑performance AI server chips, perfectly addressing the challenge of dissipating ultra‑high power densities.

- Customized composite materials Cu/Mo/Cu (CMC) and Cu/MoCu/Cu (CPC), with thermal expansion coefficients precisely matched to those of the chip, ensuring package reliability.

Changsha Shenghua Microelectronic Materials Co., Ltd. was established in 2000 and is located in the Ningxiang High-Tech Industrial Development Zone of Changsha, Hunan Province. The company is a national-level high-tech enterprise and a nationally recognized “Little Giant” enterprise specializing in niche, specialized, and innovative fields. It focuses on the R&D, production, and sales of high-performance thermal management materials for electronic packaging, holding numerous authorized patents. Its product portfolio includes tungsten–copper, molybdenum–copper, diamond–copper, and CMC/CPC composite materials, which are widely used in semiconductors, microwave and RF applications, optical communications, AI computing, data centers, and other sectors. The company serves over 600 premium customers worldwide, and its technological expertise has been recognized with both the National Defense Science and Technology Progress Award and the Hunan Provincial Science and Technology Progress Award.

We cordially invite you to join us in exploring the future.

2026 Future Industries New Materials Expo (Shanghai):

June 10–12 | Shanghai New International Expo Center

Booth No.: N2B10

The 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition (Shenzhen Show):

June 10–12 | Shenzhen International Convention & Exhibition Center (Bao’an New Hall)

Booth No.: 14G57

Changsha Shenghua Microelectronic Materials Co., Ltd. warmly welcomes all customers to visit our booth at the exhibition!

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