Microwave Radio Frequency (RF)

Application Description

Microwave amplifiers, power amplifiers, RF integrated circuits and other devices commonly used in microwave RF are usually operated in a high power and high frequency state, and a large amount of heat is generated in the process, which may cause the chip to overheat and reduce the performance and reliability. Tungsten copper, molybdenum copper, CPC and other metal heat sink materials have high thermal conductivity and low thermal expansion coefficient, can be directly welded with the chip, effectively transfer the heat to the heat dissipation system, so as to maintain the stable working state of the device.

Microwave Radio Frequency (RF)

Application of pain points

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Sublimation Solution Advantage

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Application results

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