Tungsten Copper Series

Tungsten Copper Material

Tungsten copper is a type of metal composite material that combines the low thermal expansion of tungsten with the high thermal and electrical conductivity of copper. Moreover, its material properties can be tailored through composition design to meet specific requirements. Tungsten copper materials can establish favorable thermal expansion coefficient matching with ceramics, composites, semiconductor materials, and others. This makes them commonly employed in the electronic package and heat dissipation materials for radiofrequency and microwave applications, power semiconductor devices, as well as optical communication devices.

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