Changsha Sublimation Microelectronics Material Co., Ltd.

Tungsten Copper Material

Tungsten copper is a type of metal composite material that combines the low thermal expansion of tungsten with the high thermal and electrical conductivity of copper. Moreover, its material properties can be tailored through composition design to meet specific requirements. Tungsten copper materials can establish favorable thermal expansion coefficient matching with ceramics, composites, semiconductor materials, and others. This makes them commonly employed in the electronic package and heat dissipation materials for radiofrequency and microwave applications, power semiconductor devices, as well as optical communication devices.

Classification:

Tungsten Copper Series

Key words:

Product Introduction

Feature Of Product

1、No sintering activation elements such as Fe and Co are added to maintain high thermal conductivity

2、Excellent air tightness

3、Supplying semi-finished products or surfaces coated with nickel (Ni), palladium (Pd), gold (Au), silver (Ag), copper (Cu), and other coatings

4、Good size control, surface finish and flatness

Tungsten Copper Material Properties

Material	Product Name	Component	Average linear expansion coefficient ［ppm/K］ Room temperature～400℃	Thermal conductivity ［W/(m·k)］	Mass Density ［g/cm³］	Relative Density ［%T.D.］
W-Cu	W90	W90Cu10	6.0 ～7.0	≥170	17.0±0.3	≥99
	W88	W88Cu12	6.1 ～7.1	≥175	16.9±0.3	≥99
	W87	W87Cu13	6.2 ～7.2	≥180	16.7±0.3	≥99
	W85	W85Cu15	6.4 ～7.4	≥190	16.4±0.3	≥99
	W83	W83Cu17	6.6 ～7.6	≥200	16.1±0.3	≥99
	W80	W80Cu20	7.4 ～8.9	≥210	15.6±0.3	≥99
	W75	W75Cu25	9.3～10.2	≥215	14.98±0.3	≥99
	W70	W70Cu30	9.3～10.2	≥220	14.3±0.3	≥99
	W50	W50Cu50	11.5～13.0	≥240	12.2±0.3	≥99
	W90L	W90Cu10L	6.1 ～7.1	≥180	16.8±0.3	≥99
	W85L	W85Cu15L	6.4 ～7.4	≥200	15.4±0.2	≥99
	W80L	W80Cu20L	7.4 ～8.9	≥220	15.4±0.3	≥99

Key words:

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