Changsha Sublimation Microelectronics Material Co., Ltd.

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Quality First, Customer First Quality First, Customer First
Quality First, Customer First
Focusing on high-performance electronic packaging materials
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Changsha Saneway Electronic Materials Co., Ltd. Changsha Saneway Electronic Materials Co., Ltd.
Changsha Saneway Electronic Materials Co., Ltd.
A high-tech enterprise dedicated to the research and development, production, sales, and service of high-performance electronic packaging materials
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About Saneway

Changsha Saneway Electronic Materials Co., Ltd.located in Ningxiang High-tech Zone, Changsha, Hunan, is a high-tech enterprise dedicated to the research, development, production, sale and service of high-performance electronic packaging materials. It is also one of the university-industry cooperation demonstration bases of Central South University. The company specializes in the development and production of high-performance electronic packaging materials such as tungsten-copper, molybdenum-copper, CMC（Cu/Mo/Cu）, CPC（Cu/MoCu/Cu）, diamond-copper, etc. The service areas involve microwave RF, optical communication, semiconductor lasers, power semiconductors, etc. With advanced material preparation technology, comprehensive material testing equipment and modern scientific management system, and relying on the strong technological development strength of Central South University, The company has established a leading and well-capitalized production base of electronic packaging materials in China.In the field of electronic packaging materials, the company is at the forefront of the industry and provides solid support for the continuous innovation and development of China's electronics industry.

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Microwave Radio Frequency (RF)

Microwave Radio Frequency (RF)

Characteristics: Safe, Efficient, Reliable

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Optical Communication

Optical Communication

Characteristics: Safe, Efficient, Reliable

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Semiconductor Laser

Semiconductor Laser

Characteristics: Safe, Efficient, Reliable

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Power Semiconductor

Power Semiconductor

Characteristics: Safe, Efficient, Reliable

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Supporting China and radiating the world

Sold to the United States, Germany, Japan, South Korea, Singapore and other countries and regions

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自然资源部 监制[审图号:GS(2016)1561号]

新加坡

日本

韩国

美国

ud

+400KV直流联网工程

青海格尔木一西藏拉萨

供货时间：2010年6月21日至2010年9月21日

供货产品：间隔棒、联结金具、接续金具
地址：北京市经济技术开发区地盛西路1号 数码庄园A2座

43654765电话

1@qq.com邮箱

ud

+400KV直流联网工程

青海格尔木一西藏拉萨

供货时间：2010年6月21日至2010年9月21日

供货产品：间隔棒、联结金具、接续金具
地址：北京市经济技术开发区地盛西路1号 数码庄园A2座

43654765电话

1@qq.com邮箱

加拿大

1

213214213电话

1@qq.com邮箱

box

111111111电话

1@qq.com邮箱

山东

地址：山东分公司

0000000电话

000@qq.com邮箱

Changsha Headquarters, China

新加坡

日本

韩国

美国

ud

ud

加拿大

box

山东

Changsha Headquarters, China

Dual Cities, Dual Exhibitions: A Bold Showcase | Shenghua Microelectronics Debuts Its Latest Products at Two Major Industry Events in Shanghai and Shenzhen!

Company News

Jun 10,2026

From June 10 to 12, 2026, Changsha Shenghua Microelectronic Materials Co., Ltd. (referred to as “Shenghua Microelectronics”) will make a simultaneous appearance at two of the industry’s premier trade shows: the 2026 Future Industries New Materials Expo in Shanghai and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in Shenzhen. The company will showcase its core electronic packaging thermal management materials—such as tungsten‑copper, molybdenum‑copper, and diamond‑copper—highlighting its robust technological capabilities and driving innovation across cutting-edge sectors including semiconductors, data centers, and AI computing power.

From June 10 to 12, 2026, Changsha Shenghua Microelectronic Materials Co., Ltd. (referred to as “Shenghua Microelectronics”) will make a simultaneous appearance at two of the industry’s premier trade shows: the 2026 Future Industries New Materials Expo in Shanghai and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in Shenzhen. The company will showcase its core electronic packaging thermal management materials—such as tungsten‑copper, molybdenum‑copper, and diamond‑copper—highlighting its robust technological capabilities and driving innovation across cutting-edge sectors including semiconductors, data centers, and AI computing power.

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Changsha Shenghua Microelectronics Shines at PCIM Asia 2025 Shanghai Exhibition: Empowering the Future of Power Electronics with High-Performance Materials

Company News

Sep 28,2025

From September 24 to 26, 2025, PCIM Asia Shanghai, the premier event in Asia’s power electronics industry—a leading international exhibition and conference on power components and renewable energy management—will be held grandly at Halls N4 and N5 of the Shanghai New International Expo Center.

From September 24 to 26, 2025, PCIM Asia Shanghai, the premier event in Asia’s power electronics industry—a leading international exhibition and conference on power components and renewable energy management—will be held grandly at Halls N4 and N5 of the Shanghai New International Expo Center.

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Introduction of high-activity composite powder products

Introduction of high-activity composite powder products

Our company has prepared a kind of high-activity composite powder through the spray granulation method, which is characterized by its extremely high sintering shrinkage performance. It is often used in the production of thermal sink materials with large differences in melting points, such as tungsten-copper and molybdenum-copper metal powder mixed powder billet pressing, injection molding and other production processes.

Traditional Packaging Materials

Traditional Packaging Materials

Metal packaging materials are the earliest developed packaging materials, known for their high thermal conductivity, mechanical strength, good processing performance, and electromagnetic shielding effects. Traditional metal packaging materials primarily include Cu, Al, W, Mo, as well as Kovar alloy (Fe-Co-Ni alloy) and Invar alloy (Fe-Ni alloy). Cu and Al exhibit high thermal conductivity and excellent heat dissipation performance, but their high thermal expansion coefficients make it difficult to match with silicon wafers. Thermal cycling generated by the chip during operation can cause significant stress. Additionally, Cu has a relatively high density. Kovar alloy and Invar alloy have thermal expansion coefficients that match silicon wafers well, but their lower thermal conductivity can significantly impact the performance of highly integrated packaging devices. Compared to Al, these materials have higher densities and inferior stiffness. W and Mo offer improved thermal conductivity compared to Kovar and Invar alloys, along with lower thermal expansion coefficients. However, their poor wettability with silicon wafers requires the application of Ag or Ni coatings, increasing process complexity and costs. Their higher densities also limit their use in aerospace applications.

Preparation method of metal matrix composite electronic packaging material

Preparation method of metal matrix composite electronic packaging material

This method encompasses gas pressure infiltration casting, squeeze casting, and pressure-free infiltration casting. Gas pressure infiltration casting utilizes gas to transmit pressure, pressing the molten metal into the preform to obtain a composite material. Preforms can be made through common pressing, slurry casting, and injection molding methods. This method is highly effective for producing electronic packaging materials, achieving composite materials with added particle volume percentages ranging from 50% to 80%. However, it has the disadvantages of a slower production process and lower applied pressure. Squeeze casting involves making the reinforcement into a preform, placing the preform in a mold, and infiltrating the molten metal into the reinforcement preform through liquid pressure. Although there may be some residual gas in the produced electronic packaging material, the material quality is good, with the advantages of a short production cycle and mass production capabilities. The disadvantages include higher production costs, high requirements for infiltration pressure and molds, and significant limitations on the complexity of part shapes. The manufacturing process for pressure-free infiltration casting involves placing the matrix alloy ingot onto the preform, introducing a controlled atmosphere containing N2, and heating until the alloy melts and spontaneously infiltrates into the preform. The advantages include the ability to vary the amount of Si CP as needed, lower production costs, and the ability to produce complex grid-like electronic packaging materials. The main disadvantages are that it must be performed in a controlled N2 atmosphere, certain areas of the preform may not be fully infiltrated, there may be a certain amount of porosity in the product, and the production process takes a longer time.

Tel

9

Tel

0731-83978608

Phone

9

Phone

18817146090

Skype

4

Skype

13875829015

Email

8

Email

junzhou@saneway.com

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