At the 27th China International Optoelectronics Expo, Changsha Shenghua Microelectronics is driving the rapid growth of the optoelectronics industry with its core heat-sink materials.

On September 11, the three-day 27th China International Optoelectronics Exposition (CIOE 2026) officially concluded at the Shenzhen International Convention and Exhibition Center. Centered around the theme of “AI + Optoelectronics Integration,” the event brought together more than 4,000 optoelectronics industry players from around the world, showcasing cutting-edge technological advances in areas such as intelligent computing interconnects, high-speed optical communications, and semiconductor packaging. As a leading domestic high-tech enterprise specializing in thermal management materials for microelectronics, Changsha Shenghua Microelectronic Materials Co., Ltd. exhibited its full range of core heat‑dissipation materials—including tungsten‑copper, molybdenum‑copper, diamond‑copper, copper‑molybdenum‑copper, and copper‑molybdenum‑copper‑copper—while engaging in in-depth exchanges with industry peers and upstream and downstream partners, highlighting the company’s technical prowess and practical application achievements in high‑end domestic electronic packaging thermal sinks.

A comprehensive lineup of thermal management materials makes its debut, catering to diverse cooling requirements across multiple applications.

At this exhibition, Changsha Shenghua Microelectronics showcased a range of core products that precisely address the stringent thermal management requirements across key areas highlighted at the event, including high-speed optical modules, microwave and RF devices, semiconductor lasers, and AI computing hardware.

Among these, tungsten–copper composites, with their tunable coefficient of thermal expansion and high thermal and electrical conductivity, achieve excellent thermal‑expansion matching with ceramics, Kovar alloy, and semiconductor materials, and have long been widely used for thermal management in the packaging of RF/microwave devices, power semiconductors, and optical communication components. Molybdenum–copper materials, while retaining comparable performance advantages, offer an even lower density, making them well suited for specialized applications—such as aerospace and portable electronic devices—that impose stringent weight constraints.

As one of the star products at this exhibition, the diamond‑copper metal matrix composite leverages the exceptionally high thermal conductivity of diamond particles, delivering an overall thermal conductivity far surpassing that of pure copper, while also boasting an extremely low coefficient of thermal expansion. This enables it to effectively reduce the junction temperature of high‑power chips, significantly enhancing device stability and service life, and has drawn numerous inquiries from optical module and AI‑computing hardware manufacturers.

In addition, the company’s aluminum nitride (AlN) high‑thermal‑conductivity ceramic products, renowned for their excellent thermal conductivity and superior high‑temperature resistance, drew numerous visitors to stop by and inquire, making them a highly anticipated new offering at this year’s exhibition. With a thermal conductivity ranging from 170 to 340 W/m·K and a melting point exceeding 2,200°C, these materials are widely used in applications such as electronic packaging substrates, deep‑ultraviolet optoelectronic devices, and piezoelectric components.

Connecting upstream and downstream segments of the industrial chain to jointly explore new directions in thermal management for the optoelectronics industry.

During the exhibition, the technical team from Changsha Shenghua Microelectronics engaged in in-depth discussions with industry professionals from sectors including high-speed optical communications, AI computing, microwave and RF technologies, and semiconductor packaging. Addressing key thermal‑management challenges in cutting-edge applications—such as 1.6T high‑speed optical modules, CPO co-packaged optics, T/R module carriers, and GPU liquid‑cooling solutions—the team systematically presented the performance specifications of relevant materials and tailored solution offerings, enabling downstream customers to gain a clear understanding of the independent controllability and practical value of domestically produced high‑end thermal‑dissipation materials.

Many visiting industry partners have noted that, against the backdrop of rapid expansion in AI computing infrastructure and the ongoing evolution of optoelectronic devices toward higher speeds and greater integration, upgrading the performance of core thermal‑management materials at the upstream end is a critical foundation for ensuring the long-term, stable operation of downstream components. Changsha Shenghua Microelectronics’ comprehensive product portfolio can provide robust material support for the domestic substitution efforts across the industry chain.

As a high-tech enterprise founded in 2000, Changsha Shenghua Microelectronics has long been dedicated to thermal‑management materials for electronic packaging. By continuously refining its processes and iteratively upgrading its products around specific thermal‑management applications, the company has now established a comprehensive product portfolio spanning multiple series, including tungsten‑copper, molybdenum‑copper, diamond‑copper, copper‑molybdenum‑copper, and dispersion‑strengthened copper. It can tailor material compositions and performance parameters to meet customers’ exact requirements, providing highly reliable thermal‑management solutions for clients across diverse sectors such as optoelectronics and semiconductors.

Looking ahead, Shenghua Microelectronics will continue to focus on the emerging thermal‑management needs of the industry in the context of AI‑optoelectronics convergence, steadily increasing R&D investment in new materials and accelerating the industrialization of advanced heat‑sink materials, thereby providing stronger material support for the high‑quality development of China’s optoelectronics sector.