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Current development status of the industrial laser industry

Current development status of the industrial laser industry

In recent years, the laser equipment market in China has developed rapidly, and the field of laser processing has continued to expand. In addition to light industries such as textile and clothing, and heavy industries such as automobiles, aviation, and energy, it is gradually moving towards fine processing in the fields of electronic manufacturing, mechanical micromachining, and communications. Applications in emerging industries such as medical and cosmetic equipment are also gradually expanding. The rapid development of the laser equipment industry has also driven the development of its core component laser market. According to statistics, from 2012 to 2017, the global laser market size increased from 58.1 billion yuan to 73.9 billion yuan.

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Dynamics of the Electronic Packaging Materials Industry (Part 5)

Dynamics of the Electronic Packaging Materials Industry (Part 5)

Judging from the current development status of China's new-type electronic packaging materials industry, the demand market for these materials is mainly concentrated in the three major regions of East China, North China, and South China. In recent years, the demand for new-type electronic packaging materials in East China, North China, and South China has remained at a relatively high level of development, with the demand scale of these three regions accounting for more than 80% of the total market demand scale in the country, demonstrating a high degree of regional concentration in product demand.

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Dynamics of the Electronic Packaging Materials Industry (Part 4)

Dynamics of the Electronic Packaging Materials Industry (Part 4)

Electronic packaging refers to the process of arranging, assembling, bonding, connecting, isolating, and protecting the various components of electronic devices or integrated circuits according to specified requirements. It aims to prevent moisture, dust, and harmful gases from infiltrating into electronic devices or integrated circuits, reducing vibrations, preventing external damage, and stabilizing component parameters.

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Dynamics of the Electronic Packaging Materials Industry (Part 3)

Dynamics of the Electronic Packaging Materials Industry (Part 3)

In 2017, the total market size of global electronic packaging materials was 4885.6 million US dollars, which has been growing steadily in recent years. According to QYR analysis, the market is expected to reach 6104.9 million US dollars by the end of 2023. One significant feature of the electronic packaging materials market is its cooperation with downstream semiconductor, IC, and PCB manufacturers, especially for large companies in the industry.

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Dynamics of the Electronic Packaging Materials Industry (Part 2)

Dynamics of the Electronic Packaging Materials Industry (Part 2)

Due to the rapid increase in the integration level of integrated circuits, the heat generation of chips has risen sharply, leading to a decrease in chip lifespan. It is reported that for every 10℃ increase in temperature, the failure rate due to shortened lifespan of Ga As or Si semiconductor chips triples. This is caused by thermal fatigue and thermal stress resulting from poor heat dissipation performance between materials and mismatched thermal expansion coefficients in microelectronic integrated circuits and high-power rectifier devices. The key to addressing this issue is through proper packaging. Electronic packaging materials mainly include substrates, wiring, frames, interlayer dielectrics, and sealing materials. The earliest materials used for packaging were ceramics and metals. With the continuous improvement of circuit density and functionality, higher and higher requirements have been placed on packaging technology, which has also promoted the development of packaging materials.

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5G is driving packaging innovation in the radio frequency front-end

5G is driving packaging innovation in the radio frequency front-end

Smartphones use multi-chip SiP for the front-end module, filter set, and diversity receiving module in 4G LTE. SiP provides the required small size, shorter signal paths, and lower losses. The 4G LTE front-end module currently includes 10-15 chips, connected to organic substrates (up to 8 organic layers or 18 ceramic layers) using flip-chip ball bonding or copper pillars, while some power amplifiers still use wire bonding. 5G Sub-6GHz products are expected to utilize improved existing flip-chip SiP (such as double-sided FC packaging substrates) with a similar bill of materials to achieve incremental innovation. With the introduction of new architectures, 5G millimeter-wave frequencies have brought breakthrough packaging: fan-out wafer-level packaging (WLP) and glass substrate interposers, competing with advanced organic substrate flip-chip packaging with low-loss dielectrics.

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Thermal Analysis of 5G Optical Devices

Thermal Analysis of 5G Optical Devices

Currently, 5G has become a hot topic of global interest. Everyone knows that compared to 4G, 5G's download speed has increased by at least 9 to 10 times. In the 5G network era, regardless of the type of 5G bearer scheme, it cannot be separated from 5G communication devices. The requirements for optical devices in 5G are also becoming increasingly demanding, with smaller sizes, higher integration, higher speeds, and lower power consumption. The main commonly used device speeds for 5G fronthaul, midhaul, and backhaul are 25G, 50G, 100G, 200G, and 400G optical devices, with 25G and 100G optical devices being the most widely used 5G communication devices. As speeds increase and sizes decrease, this is an inevitable trend in the development of optical devices, which also places higher requirements on internal thermal management. How to quickly and effectively dissipate heat is a serious issue that must be addressed.

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What opportunities will 5G RF bring to the packaging industry?

What opportunities will 5G RF bring to the packaging industry?

The RF System-in-Package (SiP) market can be divided into two parts: primary packaging of various RF devices, such as chip/wafer-level filters, switches, and amplifiers (including RDL, RSV, and/or bump steps); and secondary SiP packaging during the surface mount technology (SMT) stage, where various devices are assembled with passive components on the SiP substrate. In 2018, the total size of the RF front-end module SiP market (including primary and secondary packaging) was US3.3billion,anditisexpectedtogrowatacompoundannualgrowthrate(CAGR)of11.35.3 billion by 2023.

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