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Industry trends of electronic packaging materials (I)

Industry trends of electronic packaging materials (I)

The current integrated circuits are developing towards miniaturization, high-density assembly, low cost, high performance, and high reliability, which places higher demands on the substrate, wiring materials, sealing materials, and interlayer dielectric materials. The emergence of high-performance, low-cost electronic packaging materials is needed. This provides enormous room for the development of metal-based electronic packaging composite materials. By changing the shape, size, and volume fraction of the reinforcements in metal-based composite materials, it is the research direction of metal-based electronic packaging composite materials to find a material that not only matches the thermal performance of the substrate but also has good mechanical properties, and whose manufacturing method is also economically applicable.

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Electronic packaging materials

Electronic packaging materials

The development of microelectronics technology is trending towards miniaturization, high-density, high-speed, and high-reliability, correspondingly placing higher demands on the high stability and quality of packaging processes, as well as the specific properties of packaging materials.

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What are the manufacturing methods for molybdenum-copper alloys?

What are the manufacturing methods for molybdenum-copper alloys?

Liquid phase sintering method: Tungsten-copper or molybdenum-copper mixed powders are pressed and formed, followed by liquid phase sintering at 1300-1500°C. Materials produced by this method exhibit poor uniformity, numerous closed pores, and a density typically below 98%. However, the addition of a small amount of nickel through activated sintering, mechanical alloying, or oxide reduction methods to prepare ultrafine or nanometer powders can improve sintering activity, thus enhancing the density of tungsten-copper and molybdenum-copper alloys. Nickel-activated sintering can significantly reduce the electrical and thermal conductivity of the material, while impurities introduced by mechanical alloying can also affect the material's conductivity. The oxide co-reduction method for powder preparation involves a complicated process, low production efficiency, and difficulty in mass production.

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What is molybdenum-copper alloy?

What is molybdenum-copper alloy?

Molybdenum-copper alloy is a material that can be used as an alternative to copper and tungsten-copper applications. It is made from high-quality molybdenum powder and oxygen-free copper powder, and is formed using isostatic pressing (high-temperature sintering-copper infiltration). The material has a fine and dense structure, excellent arc-breaking performance, good electrical conductivity, good thermal conductivity, and low thermal expansion.

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Characteristics of tungsten-copper?

Characteristics of tungsten-copper?

Resistance welding electrode: It combines the advantages of tungsten and copper, featuring high temperature resistance, arc erosion resistance, high strength, high specific gravity, good electrical and thermal conductivity, easy machining, and sweating cooling characteristics. Due to its high hardness, high melting point, and anti-adhesion properties of tungsten, it is often used as a wear-resistant and high-temperature resistant projection welding and butt welding electrode.

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What is tungsten-copper?

What is tungsten-copper?

Tungsten-copper refers to an alloy composed of tungsten and copper, with a common copper content ranging from 10% to 50%. The alloy is produced using powder metallurgy methods and exhibits excellent electrical and thermal conductivity, good high-temperature strength, and a certain degree of plasticity. At very high temperatures, such as above 3000°C, the copper in the alloy is liquefied and evaporated, absorbing a large amount of heat and reducing the surface temperature of the material. Therefore, this type of material is also known as a metal sweating material.

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What are the key performance parameters of heat sink materials?

What are the key performance parameters of heat sink materials?

The key coefficients of heat sink materials include density, thermal expansion coefficient, and thermal conductivity.

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What is the heat sink method in LED packaging?

What is the heat sink method in LED packaging?

The term "heat sink" refers to heat dissipation. Therefore, the purpose of using a heat sink in LED packaging is to add heat dissipation fins or increase the contact area on one junction surface of the LED, in order to achieve effective heat dissipation.

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