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Product
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Technology
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Electronic packaging materials
Release time:
2023-12-08
The development of microelectronics technology is trending towards miniaturization, high-density, high-speed, and high-reliability, correspondingly placing higher demands on the high stability and quality of packaging processes, as well as the specific properties of packaging materials.
Microelectronics packaging serves to support, protect, power, and cool microelectronics devices, providing electrical and mechanical connections between the devices and the external environment.
This requires the electronic packaging materials to meet the following requirements:
1.Have a high thermal conductivity to avoid excessive heating or high temperatures in chips and devices, thus preventing failure due to thermal stress.
2.Possess a thermal expansion coefficient that matches the materials of the chip, such as silicon or gallium arsenide, or the materials of the packaged devices, to prevent thermal stress between different materials or structures and avoid component failure.
3.Exhibit sufficient strength and stiffness to protect and support the chips and devices.
4.Have a high density to ensure high reliability, preventing gas leakage and oxidation.
5.Be cost-effective, easy to process, and suitable for mass production.
6.Have specific requirements for materials in special applications such as aerospace equipment and mobile computing/communications devices, such as low density or electromagnetic and radio frequency shielding properties.
Traditional electronic packaging materials mainly include plastic packaging materials, ceramic materials for packaging, and metal packaging materials. Single materials can no longer meet the comprehensive performance requirements of packaging. However, composite packaging materials can achieve advantages superior to those of traditional electronic packaging materials through suitable processing techniques. Therefore, composite packaging materials have become the research and application focus of microelectronics packaging.
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