Industry trends of electronic packaging materials (I)

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Development Trend of Electronic Packaging Materials

The current integrated circuits are developing towards miniaturization, high-density assembly, low cost, high performance, and high reliability, which places higher demands on the substrate, wiring materials, sealing materials, and interlayer dielectric materials. The emergence of high-performance, low-cost electronic packaging materials is needed. This provides enormous room for the development of metal-based electronic packaging composite materials. By changing the shape, size, and volume fraction of the reinforcements in metal-based composite materials, it is the research direction of metal-based electronic packaging composite materials to find a material that not only matches the thermal performance of the substrate but also has good mechanical properties, and whose manufacturing method is also economically applicable.