Dynamics of the Electronic Packaging Materials Industry (Part 3)

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In 2017, the total market size of global electronic packaging materials was 4885.6 million US dollars, which has been growing steadily in recent years. According to QYR analysis, the market is expected to reach 6104.9 million US dollars by the end of 2023. One significant feature of the electronic packaging materials market is its cooperation with downstream semiconductor, IC, and PCB manufacturers, especially for large companies in the industry.

Geographically, the consumer markets in Greater China, the United States, Europe, and Japan are leading. As of 2017, Greater China held the largest market share with sales revenue of approximately 1975.5 million US dollars, followed by the United States with a market share of approximately 14.76% in 2017. China will continue to play an important role in the global market.