News Center-Changsha Saneway Electronic Materials Co., Ltd.

Changsha Sublimation Microelectronics Material Co., Ltd.

Company News

At the 27th China International Optoelectronics Expo, Changsha Shenghua Microelectronics is driving the rapid growth of the optoelectronics industry with its core heat-sink materials.

On September 11, the three-day 27th China International Optoelectronics Expo (CIOE 2026) officially came to a close at the Shenzhen International Convention and Exhibition Center.

Release time:

2026-09-15

Dual Cities, Dual Exhibitions: A Bold Showcase | Shenghua Microelectronics Debuts Its Latest Products at Two Major Industry Events in Shanghai and Shenzhen!

From June 10 to 12, 2026, Changsha Shenghua Microelectronic Materials Co., Ltd. (referred to as “Shenghua Microelectronics”) will make a simultaneous appearance at two of the industry’s premier trade shows: the 2026 Future Industries New Materials Expo in Shanghai and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in Shenzhen. The company will showcase its core electronic packaging thermal management materials—such as tungsten‑copper, molybdenum‑copper, and diamond‑copper—highlighting its robust technological capabilities and driving innovation across cutting-edge sectors including semiconductors, data centers, and AI computing power.

Release time:

2026-06-10

Changsha Shenghua Microelectronics Shines at PCIM Asia 2025 Shanghai Exhibition: Empowering the Future of Power Electronics with High-Performance Materials

From September 24 to 26, 2025, PCIM Asia Shanghai, the premier event in Asia’s power electronics industry—a leading international exhibition and conference on power components and renewable energy management—will be held grandly at Halls N4 and N5 of the Shanghai New International Expo Center.

Release time:

2025-09-28

2025 Shanghai PCIM: Shenghua Microelectronics looks forward to your visit!

Release time:

2025-07-05

Explore the future of chips, and together build the dream of materials science! Central South University's materials students successfully concluded their 2025 Ascension Internship Program!

In the scorching heat of July, enthusiasm was blazing! On July 4, Changsha Shenghua Microelectronics Materials Co., Ltd. welcomed a vibrant group of visitors—students from the Class of 2023 at the School of Materials Science and Engineering, Central South University! Filled with a deep passion for materials science and an unwavering desire for hands-on industry experience, they stepped into Shenghua, embarking on an immersive internship journey.

Release time:

2025-07-04

Changsha Shenghua Microelectronics Materials Co., Ltd. shines at the 2025 China Optoelectronics Expo in Shenzhen, leveraging high-performance electronic packaging materials to empower a new future for the optoelectronics industry.

From September 10 to 12, 2025, the 26th China International Optoelectronics Expo (CIOE)—China Optics Fair—bustled to life at the Shenzhen International Convention and Exhibition Center. As the largest and most influential industry event in the global optoelectronics sector, this year’s expo drew over 3,800 high-quality optoelectronic companies from around the world, spanning all eight core areas of the optoelectronics industry chain.

Release time:

2025-09-15

Industry News

Dynamics of the Electronic Packaging Materials Industry (Part 3)

In 2017, the total market size of global electronic packaging materials was 4885.6 million US dollars, which has been growing steadily in recent years. According to QYR analysis, the market is expected to reach 6104.9 million US dollars by the end of 2023. One significant feature of the electronic packaging materials market is its cooperation with downstream semiconductor, IC, and PCB manufacturers, especially for large companies in the industry.

2023

Dynamics of the Electronic Packaging Materials Industry (Part 2)

Due to the rapid increase in the integration level of integrated circuits, the heat generation of chips has risen sharply, leading to a decrease in chip lifespan. It is reported that for every 10℃ increase in temperature, the failure rate due to shortened lifespan of Ga As or Si semiconductor chips triples. This is caused by thermal fatigue and thermal stress resulting from poor heat dissipation performance between materials and mismatched thermal expansion coefficients in microelectronic integrated circuits and high-power rectifier devices. The key to addressing this issue is through proper packaging. Electronic packaging materials mainly include substrates, wiring, frames, interlayer dielectrics, and sealing materials. The earliest materials used for packaging were ceramics and metals. With the continuous improvement of circuit density and functionality, higher and higher requirements have been placed on packaging technology, which has also promoted the development of packaging materials.

2023

5G is driving packaging innovation in the radio frequency front-end

Smartphones use multi-chip SiP for the front-end module, filter set, and diversity receiving module in 4G LTE. SiP provides the required small size, shorter signal paths, and lower losses. The 4G LTE front-end module currently includes 10-15 chips, connected to organic substrates (up to 8 organic layers or 18 ceramic layers) using flip-chip ball bonding or copper pillars, while some power amplifiers still use wire bonding. 5G Sub-6GHz products are expected to utilize improved existing flip-chip SiP (such as double-sided FC packaging substrates) with a similar bill of materials to achieve incremental innovation. With the introduction of new architectures, 5G millimeter-wave frequencies have brought breakthrough packaging: fan-out wafer-level packaging (WLP) and glass substrate interposers, competing with advanced organic substrate flip-chip packaging with low-loss dielectrics.

2023

Thermal Analysis of 5G Optical Devices

Currently, 5G has become a hot topic of global interest. Everyone knows that compared to 4G, 5G's download speed has increased by at least 9 to 10 times. In the 5G network era, regardless of the type of 5G bearer scheme, it cannot be separated from 5G communication devices. The requirements for optical devices in 5G are also becoming increasingly demanding, with smaller sizes, higher integration, higher speeds, and lower power consumption. The main commonly used device speeds for 5G fronthaul, midhaul, and backhaul are 25G, 50G, 100G, 200G, and 400G optical devices, with 25G and 100G optical devices being the most widely used 5G communication devices. As speeds increase and sizes decrease, this is an inevitable trend in the development of optical devices, which also places higher requirements on internal thermal management. How to quickly and effectively dissipate heat is a serious issue that must be addressed.

2023

What opportunities will 5G RF bring to the packaging industry?

The RF System-in-Package (SiP) market can be divided into two parts: primary packaging of various RF devices, such as chip/wafer-level filters, switches, and amplifiers (including RDL, RSV, and/or bump steps); and secondary SiP packaging during the surface mount technology (SMT) stage, where various devices are assembled with passive components on the SiP substrate. In 2018, the total size of the RF front-end module SiP market (including primary and secondary packaging) was US3.3billion,anditisexpectedtogrowatacompoundannualgrowthrate(CAGR)of11.35.3 billion by 2023.

2023

Industry trends of electronic packaging materials (I)

The current integrated circuits are developing towards miniaturization, high-density assembly, low cost, high performance, and high reliability, which places higher demands on the substrate, wiring materials, sealing materials, and interlayer dielectric materials. The emergence of high-performance, low-cost electronic packaging materials is needed. This provides enormous room for the development of metal-based electronic packaging composite materials. By changing the shape, size, and volume fraction of the reinforcements in metal-based composite materials, it is the research direction of metal-based electronic packaging composite materials to find a material that not only matches the thermal performance of the substrate but also has good mechanical properties, and whose manufacturing method is also economically applicable.

2023

Electronic packaging materials

The development of microelectronics technology is trending towards miniaturization, high-density, high-speed, and high-reliability, correspondingly placing higher demands on the high stability and quality of packaging processes, as well as the specific properties of packaging materials.

2023

What are the manufacturing methods for molybdenum-copper alloys?

Liquid phase sintering method: Tungsten-copper or molybdenum-copper mixed powders are pressed and formed, followed by liquid phase sintering at 1300-1500°C. Materials produced by this method exhibit poor uniformity, numerous closed pores, and a density typically below 98%. However, the addition of a small amount of nickel through activated sintering, mechanical alloying, or oxide reduction methods to prepare ultrafine or nanometer powders can improve sintering activity, thus enhancing the density of tungsten-copper and molybdenum-copper alloys. Nickel-activated sintering can significantly reduce the electrical and thermal conductivity of the material, while impurities introduced by mechanical alloying can also affect the material's conductivity. The oxide co-reduction method for powder preparation involves a complicated process, low production efficiency, and difficulty in mass production.

2023

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