Industry News on Electronic Packaging Materials (Part 6)


Release time:

2023-12-08

Currently, both domestic and foreign countries have reached a relatively high level in the production and research of electronic packaging materials.

The first generation of electronic packaging materials is primarily represented by Kovar alloy (Ni-Fe), which has a thermal conductivity of 11 to 17W/(m·K), a coefficient of thermal expansion of 4.2 × 10-6/K (25 to 150 ℃), and a density of 8.1 g/cm3.

The second generation of packaging materials is primarily represented by WCu/MoCu alloys, which exhibit significantly improved thermal conductivity, reaching up to 160-200 W/(m·K). However, their coefficient of thermal expansion increases to 6.5 × 10-6 to 8.3 × 10-6/K (25 to 150 ℃), and the density increases even more, ranging from 10 to 17 g/cm3.

The preparation and application technologies for these two generations of packaging materials are well-established and have achieved industrial-scale production.

As the main representative of the third generation of packaging materials, SiCp/Al composites exhibit thermal conductivity and coefficient of thermal expansion comparable to the second generation, but with a significantly reduced density of 2.8 to 3 g/cm3. Many domestic research institutions are actively studying these materials, and the performance of their developed materials has reached advanced levels comparable to those abroad.

Diamond/Cu composites represent the fourth generation of packaging materials with higher thermal conductivity. Both domestically and internationally, research in this area is still in its early stages.

From the above development process, it can be seen that the future of WCu/MoCu alloys faces significant challenges. They may continue to be used in packaging applications, or they may be eliminated in competition with other materials.

Therefore, based on existing technologies, it is urgent to further study and improve the performance of WCu/MoCu alloys to maintain their competitive advantage as packaging materials.