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Electronic packaging materials

The development of microelectronics technology is trending towards miniaturization, high-density, high-speed, and high-reliability, correspondingly placing higher demands on the high stability and quality of packaging processes, as well as the specific properties of packaging materials.

2023

12-08

What are the manufacturing methods for molybdenum-copper alloys?

Liquid phase sintering method: Tungsten-copper or molybdenum-copper mixed powders are pressed and formed, followed by liquid phase sintering at 1300-1500°C. Materials produced by this method exhibit poor uniformity, numerous closed pores, and a density typically below 98%. However, the addition of a small amount of nickel through activated sintering, mechanical alloying, or oxide reduction methods to prepare ultrafine or nanometer powders can improve sintering activity, thus enhancing the density of tungsten-copper and molybdenum-copper alloys. Nickel-activated sintering can significantly reduce the electrical and thermal conductivity of the material, while impurities introduced by mechanical alloying can also affect the material's conductivity. The oxide co-reduction method for powder preparation involves a complicated process, low production efficiency, and difficulty in mass production.

2023

12-08

What is molybdenum-copper alloy?

Molybdenum-copper alloy is a material that can be used as an alternative to copper and tungsten-copper applications. It is made from high-quality molybdenum powder and oxygen-free copper powder, and is formed using isostatic pressing (high-temperature sintering-copper infiltration). The material has a fine and dense structure, excellent arc-breaking performance, good electrical conductivity, good thermal conductivity, and low thermal expansion.

2023

12-08

Characteristics of tungsten-copper?

Resistance welding electrode: It combines the advantages of tungsten and copper, featuring high temperature resistance, arc erosion resistance, high strength, high specific gravity, good electrical and thermal conductivity, easy machining, and sweating cooling characteristics. Due to its high hardness, high melting point, and anti-adhesion properties of tungsten, it is often used as a wear-resistant and high-temperature resistant projection welding and butt welding electrode.

2023

12-08

What is tungsten-copper?

Tungsten-copper refers to an alloy composed of tungsten and copper, with a common copper content ranging from 10% to 50%. The alloy is produced using powder metallurgy methods and exhibits excellent electrical and thermal conductivity, good high-temperature strength, and a certain degree of plasticity. At very high temperatures, such as above 3000°C, the copper in the alloy is liquefied and evaporated, absorbing a large amount of heat and reducing the surface temperature of the material. Therefore, this type of material is also known as a metal sweating material.

2023

12-08

What are the key performance parameters of heat sink materials?

The key coefficients of heat sink materials include density, thermal expansion coefficient, and thermal conductivity.

2023

12-08

What is the heat sink method in LED packaging?

The term "heat sink" refers to heat dissipation. Therefore, the purpose of using a heat sink in LED packaging is to add heat dissipation fins or increase the contact area on one junction surface of the LED, in order to achieve effective heat dissipation.

2023

12-08

What is the difference between a heat exchanger and a heat sink?

In industrial applications, a heat sink typically refers to a miniature cooling device used to cool electronic chips. On the other hand, a heat exchanger is a device designed to transfer heat from a hot fluid to a cold fluid, meeting specific process requirements.

2023

12-08

What is a heat sink?

A heat sink refers to an object whose temperature remains constant despite the amount of heat energy transferred to it. It can be anything from the atmosphere to the ground.

2023

12-08

Are heat sink materials and electronic packaging materials the same concept?

No, they are not the same concept. Heat sink materials are specifically designed for use as heat sinks, while electronic packaging materials encompass a much broader range of materials, making it a larger concept. Some heat sink materials can be used for electronic packaging, but not all of them.

2023

12-08

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