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Inherit the Red Gene, Carry Forward the Jinggangshan Spirit - Report on the Party Branch Activity of Changsha Saneway Electronic Materials Co., Ltd.

From May 17th to 19th, 2019, all Party members, active Party applicants, and company cadres of Changsha Saneway Electronics Materials Co., Ltd. traveled to Jinggangshan, the cradle of the red revolution, for study and training with great respect for the older generation of proletarian revolutionaries and yearning for the sacred place of revolution. They personally experienced the great spirit of the sacred place of revolution. More than 20 people from the company visited revolutionary historical memorial sites and patriotic education bases such as Hu Yaobang's former residence, the Wenjiashi Memorial Hall of the Autumn Harvest Uprising, the former site of the Huangyangjie Defense Battle, the Mint, the Xiaojing Red Army Hospital, the Beishan Revolutionary Martyrs' Cemetery, and the Jinggangshan Revolutionary Museum. They systematically conducted a vivid revolutionary tradition education.

2023

12-08

Changsha Saneway Participated in the 2019 Munich Shanghai Light Expo

Changsha Saneway Electronics Materials Co., Ltd., which is in a leading position in the field of electronic packaging materials in China, participated in the Munich Shanghai Light Expo. The exhibition was held at the Shanghai New International Expo Center from March 20th to 22nd, 2019. Changsha Saneway showcased its high-performance electronic packaging materials including W/Cu, Mo/Cu, Cu/Mo/Cu, and Cu/Mo70Cu/Cu.

2023

12-08

The 4th Juguang Technology Laser Application Industry Forum

On September 19th, 2019, Jiang Guosheng, General Manager of Changsha Saneway Electronic Materials Co., Ltd., and Zhou Jun, Deputy General Manager, were invited to participate in the 4th Juguang Technology Laser Application Industry Forum. Born in 2015, after four years of careful development, the forum has become an important industry-academia-research exchange platform for high-power semiconductor lasers and micro-optics industries in China.

2023

12-08

Industry News on Electronic Packaging Materials (Part 6)

Currently, both domestic and foreign countries have reached a relatively high level in the production and research of electronic packaging materials.

2023

12-08

Current development status of the industrial laser industry

In recent years, the laser equipment market in China has developed rapidly, and the field of laser processing has continued to expand. In addition to light industries such as textile and clothing, and heavy industries such as automobiles, aviation, and energy, it is gradually moving towards fine processing in the fields of electronic manufacturing, mechanical micromachining, and communications. Applications in emerging industries such as medical and cosmetic equipment are also gradually expanding. The rapid development of the laser equipment industry has also driven the development of its core component laser market. According to statistics, from 2012 to 2017, the global laser market size increased from 58.1 billion yuan to 73.9 billion yuan.

2023

12-08

Dynamics of the Electronic Packaging Materials Industry (Part 5)

Judging from the current development status of China's new-type electronic packaging materials industry, the demand market for these materials is mainly concentrated in the three major regions of East China, North China, and South China. In recent years, the demand for new-type electronic packaging materials in East China, North China, and South China has remained at a relatively high level of development, with the demand scale of these three regions accounting for more than 80% of the total market demand scale in the country, demonstrating a high degree of regional concentration in product demand.

2023

12-08

Dynamics of the Electronic Packaging Materials Industry (Part 4)

Electronic packaging refers to the process of arranging, assembling, bonding, connecting, isolating, and protecting the various components of electronic devices or integrated circuits according to specified requirements. It aims to prevent moisture, dust, and harmful gases from infiltrating into electronic devices or integrated circuits, reducing vibrations, preventing external damage, and stabilizing component parameters.

2023

12-08

Dynamics of the Electronic Packaging Materials Industry (Part 3)

In 2017, the total market size of global electronic packaging materials was 4885.6 million US dollars, which has been growing steadily in recent years. According to QYR analysis, the market is expected to reach 6104.9 million US dollars by the end of 2023. One significant feature of the electronic packaging materials market is its cooperation with downstream semiconductor, IC, and PCB manufacturers, especially for large companies in the industry.

2023

12-08

Dynamics of the Electronic Packaging Materials Industry (Part 2)

Due to the rapid increase in the integration level of integrated circuits, the heat generation of chips has risen sharply, leading to a decrease in chip lifespan. It is reported that for every 10℃ increase in temperature, the failure rate due to shortened lifespan of Ga As or Si semiconductor chips triples. This is caused by thermal fatigue and thermal stress resulting from poor heat dissipation performance between materials and mismatched thermal expansion coefficients in microelectronic integrated circuits and high-power rectifier devices. The key to addressing this issue is through proper packaging. Electronic packaging materials mainly include substrates, wiring, frames, interlayer dielectrics, and sealing materials. The earliest materials used for packaging were ceramics and metals. With the continuous improvement of circuit density and functionality, higher and higher requirements have been placed on packaging technology, which has also promoted the development of packaging materials.

2023

12-08

5G is driving packaging innovation in the radio frequency front-end

Smartphones use multi-chip SiP for the front-end module, filter set, and diversity receiving module in 4G LTE. SiP provides the required small size, shorter signal paths, and lower losses. The 4G LTE front-end module currently includes 10-15 chips, connected to organic substrates (up to 8 organic layers or 18 ceramic layers) using flip-chip ball bonding or copper pillars, while some power amplifiers still use wire bonding. 5G Sub-6GHz products are expected to utilize improved existing flip-chip SiP (such as double-sided FC packaging substrates) with a similar bill of materials to achieve incremental innovation. With the introduction of new architectures, 5G millimeter-wave frequencies have brought breakthrough packaging: fan-out wafer-level packaging (WLP) and glass substrate interposers, competing with advanced organic substrate flip-chip packaging with low-loss dielectrics.

2023

12-08

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