Diamond Metal Matrix Composites

Diamond Metal Matrix Composites unlock powerful cooling and strength for next-generation technologies.

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Diamond Metal Matrix Composites


Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion.

Diamond Metal Matrix Composites


Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion.

The Pinnacle of Thermal Management: Why Diamond Metal Matrix Composites are Changing the Game


In the world of high-performance electronics and industrial computing, heat is the ultimate enemy

The Pinnacle of Thermal Management: Why Diamond Metal Matrix Composites are Changing the Game


In the world of high-performance electronics and industrial computing, heat is the ultimate enemy

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