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Product
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Technology
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Copper/Molybdenum-Copper/Copper Materials
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Detailed introduction
Product Introduction
Copper/molybdenum copper(Pressed)/Cu (CPC) is a composite material with a central core of metal molybdenum copper sandwiched between pure copper layers on both sides, forming a "sandwich" structure. CPC exhibits a slightly higher coefficient of thermal expansion compared to CMC. However, it possesses superior bonding strength between copper and molybdenum copper and higher thermal conductivity, resulting in enhanced reliability and heat dissipation. Common thickness ratios for each layer in CPC include 1:4:1, 2:3:2, 1:1:1, and others. The layer thickness can be adjusted as needed to achieve optimal performance.
Feature Of Product
1、Higher thermal conductivity than copper/molybdenum/copper materials
2、Can be punched into parts to reduce costs
3、The interface is firmly bonded and can withstand repeated high-temperature impacts of 850℃
4、Designable thermal expansion coefficient to match materials such as semiconductors and ceramics
5、Non-magnetic
Copper/molybdenum-copper/copper Materials
|
Material |
Product Name |
Component |
RT CTE ［ppm/K］ |
Thermal ［W/(m·k)］ |
Mass Density ［g/cm3］ |
|
CPC |
CPC111 |
Cu/Mo70-Cu/Cu |
9.0±0.5 |
>280 |
9.1±0.2 |
|
CPC232 |
8.8±0.5 |
>260 |
9.27±0.2 |
||
|
CPC141 |
8.2±0.5 |
>200 |
9.5±0.3 |
||
|
CPC111 represents a Cu/Mo70 Cu/Cu thickness ratio of 1:1:1 |
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