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Diamond Metal Matrix Composites
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Diamond Metal Matrix Composites
Detailed introduction
Product Introduction
Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion. Our diamond-copper and diamond-aluminum materials are characterized by high thermal conductivity, low thermal expansion coefficients, low density, and metallizable surfaces, making them suitable for heat dissipation in high-power electronic device packaging. This effectively reduces chip junction temperatures, enhancing their performance and reliability.
Feature Of Product
1、High thermal conductivity, low coefficient of thermal expansion, and adjustable performance
2、Low density, reducing the weight of the device
3、The surface is capable of metallization treatment and can be plated with nickel and gold
4、Capable of fabricating non-traditional structural components such as convex domes, concave grooves, and other irregular shapes
Performance Table of Metal Fund Corundum Composite Materials
| Materials | Type | Thermal W/(m·Kx-y) | RT~200°C CTE ［ppm/K］ | Density ［g/cm3］ |
| Diamond-copper | DCu-A | >700 | 6.5±1 | <6 |
| DCu-B | >550 | |||
| Diamond-Aluminium | DAI-A | >500 | 7±1 | <3.2 |
| DAI-B | >400 |
Diamond Metal Matrix Composites combine the exceptional thermal conductivity of diamond with the strength of metal materials to create advanced engineering solutions. Designed for demanding applications, Diamond Metal Matrix Composites provide excellent heat dissipation, lightweight performance, and superior stability, making them ideal for electronic packaging and high-performance industries.
With outstanding thermal management capability and reliable mechanical properties, Diamond Metal Matrix Composites help solve challenges such as overheating, limited component lifespan, and inefficient heat transfer. They are widely used in aerospace, semiconductor, power electronics, and precision equipment where performance requirements are extremely high.
A semiconductor manufacturer adopted Diamond Metal Matrix Composites for thermal control components, significantly improving heat dissipation efficiency and system reliability. The advanced material solution helped reduce thermal stress and extend equipment operating life.
For companies seeking innovative material technologies, Diamond Metal Matrix Composites deliver durability, efficiency, and competitive advantages. Choosing Diamond Metal Matrix Composites enables better thermal performance, improved product quality, and stronger market value.
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