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Performance of Tungsten-Copper and Molybdenum-Copper Materials for Electronic Packaging

WCu and MoCu alloys are primarily used in large-scale integrated circuits and high-power microwave devices as insulating metal substrates, thermal control plates, heat dissipation components (heat sink materials), and lead frames. For electronic packaging materials, their quality and performance must meet extremely high requirements. Not only do they require high purity and air tightness (high density), low gas content, and uniform micro structure, but they also demand high thermal conductivity and a thermal expansion coefficient that matches the chip.

2023

12-08

Composite Materials for Electronic Packaging

Composite materials are composed of two or more different materials, which can have the comprehensive properties of different materials. At present, there are three main types of composite materials in the field of electronic packaging.

2023

12-08

Heat-conducting material

Heat conductive materials are a new type of industrial materials designed in recent years to meet the heat transfer requirements of equipment, with excellent and reliable performance. They are suitable for various environments and requirements, and have proper countermeasures for possible heat conduction problems. They provide powerful support for the high integration and ultra-small and ultra-thin design of equipment. This heat conductive product has been increasingly applied to many products, improving the reliability of the products.

2023

12-08

This is a successful case of sublimation in the laser industry

In recent years, with the breakthrough of domestic laser packaging technology, it has broken the embarrassing situation that the finished laser tube shell can only be imported from abroad.

2023

12-08

Successful cases of sublimation in the optical communication industry

With the promotion of 4G networks and the upcoming 5G era, the development of high-power semiconductor devices and optical communication modules has been greatly promoted.

2023

12-08

Successful case of sublimation in microwave RF industry

Changsha Sublimation Microelectronics Materials Co., Ltd. has been based on national infrastructure since its establishment in 2000. Provide tungsten copper, molybdenum copper microelectronic packaging materials for microwave electronics.

2023

12-08

Empowered by CIOE, Microelectronics of saneway moved forward with concentration and shone at the 24th China International Optoelectronic Exposition

From September 6th to 8th, 2023, the 24th China International Optoelectronic Exposition was grandly held at the Shenzhen International Convention and Exhibition Center. This exhibition gathered more than 3,000 high-quality exhibitors from around the world, covering the full industry chain of optoelectronics including information communication, optics, laser, infrared, ultraviolet, sensing, innovation, and new displays. It focused on displaying materials, devices, equipment, technologies, and complete solutions, providing new technologies and models for the optoelectronics industry and downstream applications.

2023

12-08

Win-win cooperation, innovation and sharing. Changsha saneway bloomed at the 2023 Munich Shanghai Optoelectronic Exhibition

The Shanghai Munich Optoelectronic Exhibition closed successfully at the Shanghai Hongqiao Convention and Exhibition Center at 17:00 on July 13, 2023. From basic research to industrial applications, the Munich Shanghai Expo followed the industry development trend and focused on displaying four major sections: lasers and optoelectronics, optics and optical manufacturing, laser production and processing technology, imaging, testing, and quality control.

2023

12-08

Saneway electronics settled in the R&D headquarters of Central South University Science Park

On May 8, a signing ceremony was held between Changsha Saneway Electronic Materials Co., Ltd., a national specialized, innovative, and leading "small giant" enterprise, and the platform company of Central South University Science and Technology Park (R&D) headquarters. Reported by Wang Mingjun, a reporter from Hunan Daily on May 10th, the correspondent was Chen Min.

2023

12-08

Our company was awarded the third prize in the National Finals of the 11th China Innovation and Entrepreneurship Competition.

The 11th China Innovation and Entrepreneurship Competition National Finals concluded on December 30, 2022, in Shenzhen, where 100 enterprises from various regions across the country competed for the highest annual award. Our company, Changsha saneway Electronic Materials Co., Ltd., recommended by our province, won the third prize in the growth group (a total of 8 across the country) for its project "Application of Thermal Sink Materials for High-Speed Optical Modules in Big Data Centers" and was honored as one of the "Top 50 Innovation and Entrepreneurship Enterprises" in the 11th China Innovation and Entrepreneurship Competition. This is another significant award won by our company this year, following its recognition as a national fourth-batch "specialized, innovative, and leading" small and medium-sized enterprise.

2023

12-08

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