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Kovar Coated by Silver-Copper Material
Kovar alloy, owing to its lower coefficient of thermal expansion, exhibits excellent thermal compatibility with ceramics and chip materials. It is commonly employed as the raw material for lead frames in electronic device packaging. Kovar is typically joined with other materials using silver-copper solder at temperatures exceeding 800 degrees Celsius. Kovar coated by silver-copper materials prefabricate silver-copper solder on the surface of Kovar, allowing for precise control over the composition, quantity, and shape of the solder. This approach helps mitigate errors and costs associated with manually attaching solder elements.
Highly Active Composite Powder Products
Our company has developed a highly active composite powder, which has high sintering shrinkage performance. It is often used in the production of heat sink materials with large melting point difference, such as mixed powder of tungsten copper and molybdenum copper metal powders for press forming, injection molding and other production processes. Unlike traditional powders, our composite powder is closely bonded at the molecular level in the compound stage.
Power semiconductor devices are widely used in motor drive, charging pile, photovoltaic wind power generation and other fields of current control and conversion. Power semiconductor devices have a certain on-resistance and switching loss during the turn-on and turn-off process, which will generate a lot of heat. In order to ensure the normal operation of the power module, tungsten copper, molybdenum copper and their composite materials can be used as the base plate material of the power module to reduce the mismatch with the thermal expansion coefficient of the ceramic substrate, and can also be used as the spacer and lead frame in the double-sided heat dissipation module to improve the heat dissipation capacity of the chip and improve the efficiency and reliability of the entire power electronic system.
Microwave Radio Frequency (RF)
Microwave amplifiers, power amplifiers, RF integrated circuits and other devices commonly used in microwave RF are usually operated in a high power and high frequency state, and a large amount of heat is generated in the process, which may cause the chip to overheat and reduce the performance and reliability. Tungsten copper, molybdenum copper, CPC and other metal heat sink materials have high thermal conductivity and low thermal expansion coefficient, can be directly welded with the chip, effectively transfer the heat to the heat dissipation system, so as to maintain the stable working state of the device.
In optical communication systems, laser diodes (LDs) and other optical components operate at high power for a long time. Metal materials such as tungsten and copper are usually used in the base of optical communication tube shells and other heat dissipation structures to effectively absorb and conduct the generated heat, maintain the optical performance of the optical communication system, prevent laser wavelength drift and communication efficiency reduction caused by chip temperature rise, and improve the stability of the communication system.
Copper/Molybdenum-Copper/Copper Materials
Copper/molybdenum copper(Pressed)/Cu (CPC) is a composite material with a central core of metal molybdenum copper sandwiched between pure copper layers on both sides, forming a "sandwich" structure. CPC exhibits a slightly higher coefficient of thermal expansion compared to CMC. However, it possesses superior bonding strength between copper and molybdenum copper and higher thermal conductivity, resulting in enhanced reliability and heat dissipation.
Tungsten copper is a type of metal composite material that combines the low thermal expansion of tungsten with the high thermal and electrical conductivity of copper. Moreover, its material properties can be tailored through composition design to meet specific requirements. Tungsten copper materials can establish favorable thermal expansion coefficient matching with ceramics, composites, semiconductor materials, and others. This makes them commonly employed in the electronic package and heat dissipation materials for radiofrequency and microwave applications, power semiconductor devices, as well as optical communication devices.
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. However, the density of molybdenum copper is much smaller than that of tungsten copper, making it more suitable for aerospace and other fields.
Copper Molybdenum Copper Material
Copper/molybdenum/copper (CMC) is a composite material with a core made of metal molybdenum and coated on both sides with pure copper, forming a "sandwich" structure. CMC can be characterized as a material with adjustable properties based on the thickness ratio of copper and molybdenum metals. It exhibits high thermal conductivity, high strength, and a low coefficient of thermal expansion.This material finds applications as a heat sink and heat dissipation base for components such as radiofrequency tube casings and multilayer ceramics.
Diamond Metal Matrix Composites
Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion.
SAF Coolest v1.2 设置面板 FAUSX-AVRN-GZXAE-AVZ
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