Tungsten Copper Material

Tungsten copper is a type of metal composite material that combines the low thermal expansion of tungsten with the high thermal and electrical conductivity of copper. Moreover, its material properties can be tailored through composition design to meet specific requirements. Tungsten copper materials can establish favorable thermal expansion coefficient matching with ceramics, composites, semiconductor materials, and others. This makes them commonly employed in the electronic package and heat dissipation materials for radiofrequency and microwave applications, power semiconductor devices, as well as optical communication devices.

Molybdenum Copper Material

Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. However, the density of molybdenum copper is much smaller than that of tungsten copper, making it more suitable for aerospace and other fields.

Copper Molybdenum Copper Material

Copper/molybdenum/copper (CMC) is a composite material with a core made of metal molybdenum and coated on both sides with pure copper, forming a "sandwich" structure. CMC can be characterized as a material with adjustable properties based on the thickness ratio of copper and molybdenum metals. It exhibits high thermal conductivity, high strength, and a low coefficient of thermal expansion.This material finds applications as a heat sink and heat dissipation base for components such as radiofrequency tube casings and multilayer ceramics.

Diamond Metal Matrix Composites

Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion.

Copper/Molybdenum-Copper/Copper Materials

Copper/molybdenum copper(Pressed)/Cu (CPC) is a composite material with a central core of metal molybdenum copper sandwiched between pure copper layers on both sides, forming a "sandwich" structure. CPC exhibits a slightly higher coefficient of thermal expansion compared to CMC. However, it possesses superior bonding strength between copper and molybdenum copper and higher thermal conductivity, resulting in enhanced reliability and heat dissipation.

Dispersion-Strengthened Copper Material

Dispersion-strengthened copper, also known as alumina dispersion-strengthened copper, is an outstanding High strength and high conductivity copper alloys materials. Utilizing nanoscale alumina as the reinforcing phase, the material is characterized by high hardness, strength, electrical conductivity, and a high softening temperature. Dispersion-strengthened copper serves as an excellent electrode material, exhibiting good weldability with plated metals such as galvanized and nickel-plated steel sheets, as well as aluminum alloys.

Copper Aluminum Composite Strip/Bonding Sheet Material

Copper-aluminum composite strip is formed by combining oxygen-free copper with high-purity aluminum, and it is subsequently stamped into various components such as leads, washers, and other parts as required. The thickness of the composite strip is adjustable and is commonly used for bonding aluminum wires and lead terminals in power devices.

Kovar/Copper/Kovar(KCK) Composite Material

Our company has successfully developed kovar/copper/kovar composite strips based on the process of CPC(Cu/MoCu/Cu)and CMC(Cu/Mo/Cu), with adjustable three-layer thickness ratio. Subsequently, etching or stamping processes are used to prepare frame leads. This material has significantly improved thermal conductivity and conductivity compared to pure kovar leads, and is widely used in the military electronics field.

Kovar Coated by Silver-Copper Material

Kovar alloy, owing to its lower coefficient of thermal expansion, exhibits excellent thermal compatibility with ceramics and chip materials. It is commonly employed as the raw material for lead frames in electronic device packaging. Kovar is typically joined with other materials using silver-copper solder at temperatures exceeding 800 degrees Celsius. Kovar coated by silver-copper materials prefabricate silver-copper solder on the surface of Kovar, allowing for precise control over the composition, quantity, and shape of the solder. This approach helps mitigate errors and costs associated with manually attaching solder elements.

Highly Active Composite Powder Products

Our company has developed a highly active composite powder, which has high sintering shrinkage performance. It is often used in the production of heat sink materials with large melting point difference, such as mixed powder of tungsten copper and molybdenum copper metal powders for press forming, injection molding and other production processes. Unlike traditional powders, our composite powder is closely bonded at the molecular level in the compound stage.

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