Changsha Sublimation Microelectronics Material Co., Ltd.

Product Center

Tungsten Copper Series

Molybdenum Copper Series

Copper-Molybdenum-Copper Series

Metal-Bonded Diamond Series

Copper-Molybdenum-Copper-Copper Series

Dispersion Strengthened Copper Series

Copper-Aluminum Composite Tape/Bonding Sheet Series

Kovar Series / Oxygen-Free Copper Series

Other Series

Electroplating Service

Diamond Metal Matrix Composites

Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion.

Copper Aluminum Composite Strip/Bonding Sheet Material

Copper-aluminum composite strip is formed by combining oxygen-free copper with high-purity aluminum, and it is subsequently stamped into various components such as leads, washers, and other parts as required. The thickness of the composite strip is adjustable and is commonly used for bonding aluminum wires and lead terminals in power devices.

Dispersion-Strengthened Copper Material

Dispersion-strengthened copper, also known as alumina dispersion-strengthened copper, is an outstanding High strength and high conductivity copper alloys materials. Utilizing nanoscale alumina as the reinforcing phase, the material is characterized by high hardness, strength, electrical conductivity, and a high softening temperature. Dispersion-strengthened copper serves as an excellent electrode material, exhibiting good weldability with plated metals such as galvanized and nickel-plated steel sheets, as well as aluminum alloys.

Semiconductor Laser

Semiconductor lasers are widely used in medical, communications and industrial fields, but bar chips also generate a lot of heat while emitting light. As the heat dissipation base or transition heat sink of the semiconductor laser bar, the metal heat sink material such as tungsten copper has the characteristics of low thermal expansion coefficient and high thermal conductivity. Whether it is soldering or brazing, the bar and the heat sink have good matching, small smile effect, can achieve good heat dissipation, keep the bar running in a stable temperature range, prevent the laser from reducing performance or shortening life due to overheating, and improve the stability and consistency of its output.