News Center-Changsha Saneway Electronic Materials Co., Ltd.

Changsha Sublimation Microelectronics Material Co., Ltd.

Company News

At the 27th China International Optoelectronics Expo, Changsha Shenghua Microelectronics is driving the rapid growth of the optoelectronics industry with its core heat-sink materials.

On September 11, the three-day 27th China International Optoelectronics Expo (CIOE 2026) officially came to a close at the Shenzhen International Convention and Exhibition Center.

Release time:

2026-09-15

Dual Cities, Dual Exhibitions: A Bold Showcase | Shenghua Microelectronics Debuts Its Latest Products at Two Major Industry Events in Shanghai and Shenzhen!

From June 10 to 12, 2026, Changsha Shenghua Microelectronic Materials Co., Ltd. (referred to as “Shenghua Microelectronics”) will make a simultaneous appearance at two of the industry’s premier trade shows: the 2026 Future Industries New Materials Expo in Shanghai and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition in Shenzhen. The company will showcase its core electronic packaging thermal management materials—such as tungsten‑copper, molybdenum‑copper, and diamond‑copper—highlighting its robust technological capabilities and driving innovation across cutting-edge sectors including semiconductors, data centers, and AI computing power.

Release time:

2026-06-10

Changsha Shenghua Microelectronics Shines at PCIM Asia 2025 Shanghai Exhibition: Empowering the Future of Power Electronics with High-Performance Materials

From September 24 to 26, 2025, PCIM Asia Shanghai, the premier event in Asia’s power electronics industry—a leading international exhibition and conference on power components and renewable energy management—will be held grandly at Halls N4 and N5 of the Shanghai New International Expo Center.

Release time:

2025-09-28

2025 Shanghai PCIM: Shenghua Microelectronics looks forward to your visit!

Release time:

2025-07-05

Explore the future of chips, and together build the dream of materials science! Central South University's materials students successfully concluded their 2025 Ascension Internship Program!

In the scorching heat of July, enthusiasm was blazing! On July 4, Changsha Shenghua Microelectronics Materials Co., Ltd. welcomed a vibrant group of visitors—students from the Class of 2023 at the School of Materials Science and Engineering, Central South University! Filled with a deep passion for materials science and an unwavering desire for hands-on industry experience, they stepped into Shenghua, embarking on an immersive internship journey.

Release time:

2025-07-04

Changsha Shenghua Microelectronics Materials Co., Ltd. shines at the 2025 China Optoelectronics Expo in Shenzhen, leveraging high-performance electronic packaging materials to empower a new future for the optoelectronics industry.

From September 10 to 12, 2025, the 26th China International Optoelectronics Expo (CIOE)—China Optics Fair—bustled to life at the Shenzhen International Convention and Exhibition Center. As the largest and most influential industry event in the global optoelectronics sector, this year’s expo drew over 3,800 high-quality optoelectronic companies from around the world, spanning all eight core areas of the optoelectronics industry chain.

Release time:

2025-09-15

Industry News

Changsha Shenghua Microelectronics Staff Symposium: Listen to the voice and seek common development

On June 18, Changsha Shenghua Microelectronic Materials Co., Ltd. held the second employee symposium of the year in the coffee bar on the first floor of the new factory. The symposium was presided over by Li Bo, Minister of Human Resources, aiming to listen to the voices of employees, solve the problems encountered by employees in their work, and further enhance the cohesion and centripetal force of the company.

2024

Concentrate on Development and Strive for Progress-Review of 2024 Team Expansion Activities of Changsha Sublimation Microelectronic Materials Co., Ltd.

In Changsha Sublimation Microelectronics Materials Co., Ltd., we firmly believe that the strength of the team is the core driving force to promote the development of the company. On April 20, 2024, we held a meaningful team development activity with the theme of "concentrating on development, forging ahead and composing a new chapter.

2024

Strengthen the construction of talents and help employees grow-Changsha sublimation microelectronics materials co., ltd. held a ceremony for the confirmation of labor service employees to build a new chapter in talents!

In order to further strengthen the construction of the company's talent team and encourage labor employees to actively participate in the work, Changsha Shenghua Microelectronics Materials Co., Ltd. specially held a grand labor employee confirmation ceremony. This is not only an affirmation of the hard work of employees, but also another powerful measure for the company to focus on talent training and promote talent echelon construction.

2024

Taking Party Building as the Engine to Promote the High Quality Development of Saneway

2024

Changsha Saneway Electronic Staff Symposium Successfully Held: Cohesion and Common Development

2024

Spring in Shanghai Autumn in Shenzhen ，Changsha saneway Electronic Materials Co., Ltd. Appears at 2024 Munich Shanghai Light Expo

In the spring season, the 2024 Munich Shanghai Light Expo will be held in Shanghai New International Expo Center from March 20 to 22.

2024

Introduction of high-activity composite powder products

Our company has prepared a kind of high-activity composite powder through the spray granulation method, which is characterized by its extremely high sintering shrinkage performance. It is often used in the production of thermal sink materials with large differences in melting points, such as tungsten-copper and molybdenum-copper metal powder mixed powder billet pressing, injection molding and other production processes.

2023

Traditional Packaging Materials

Metal packaging materials are the earliest developed packaging materials, known for their high thermal conductivity, mechanical strength, good processing performance, and electromagnetic shielding effects. Traditional metal packaging materials primarily include Cu, Al, W, Mo, as well as Kovar alloy (Fe-Co-Ni alloy) and Invar alloy (Fe-Ni alloy). Cu and Al exhibit high thermal conductivity and excellent heat dissipation performance, but their high thermal expansion coefficients make it difficult to match with silicon wafers. Thermal cycling generated by the chip during operation can cause significant stress. Additionally, Cu has a relatively high density. Kovar alloy and Invar alloy have thermal expansion coefficients that match silicon wafers well, but their lower thermal conductivity can significantly impact the performance of highly integrated packaging devices. Compared to Al, these materials have higher densities and inferior stiffness. W and Mo offer improved thermal conductivity compared to Kovar and Invar alloys, along with lower thermal expansion coefficients. However, their poor wettability with silicon wafers requires the application of Ag or Ni coatings, increasing process complexity and costs. Their higher densities also limit their use in aerospace applications.

2023

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Contact Information

Sales Hotline：0731-83978608

Phone：18817146090(Same number on WeChat)
E-mail：junzhou@saneway.com

Enterprise address: No. 435, Section 3, jinzhou Avenue, Ningxiang High-tech Zone, Changsha

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