Changsha Sublimation Microelectronics Material Co., Ltd.

In-station search

Home page

业内动态

Home page

Hot Products

Kovar Coated by Silver-Copper Material

Highly Active Composite Powder Products

Power Semiconductor

Microwave Radio Frequency (RF)

Industry dynamics

Business Opportunity Information

Next-Gen Thermal Management: How Diamond Metal Matrix Composites Solve High-Power Semiconductor Heat Challenges

At the 27th China International Optoelectronics Expo, Changsha Shenghua Microelectronics is driving the rapid growth of the optoelectronics industry with its core heat-sink materials.

On September 11, the three-day 27th China International Optoelectronics Expo (CIOE 2026) officially came to a close at the Shenzhen International Convention and Exhibition Center.

Mastering Thermal Control: Molybdenum Copper Materials Power High-Density Microelectronics

Unlocking Thermal Efficiency with Advanced Tungsten Copper Material

As modern electronics pack computing power into smaller footprints, managing thermal energy is an uphill battle

Bridging Thermal Expansion and High Conductivity

Breakthrough Composite Material Solves Thermal and Electrical Bottlenecks in High-Power Electronics

Modern microelectronic packaging, high-frequency microwave communications, and semiconductor systems face severe operational heat loads alongside strict requirements for thermal expansion matching

Product Label

Dedicated to provide customers with quality products and timely and thoughtful service