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Copper Molybdenum Copper Material – Advanced Thermal Management Solution for High-Performance Electronics
Copper Molybdenum Copper Material is a high-performance composite material widely used in power electronics, semiconductor packaging, aerospace, and communication industries
2026
05-26
Changsha Shenghua Microelectronics Shines at PCIM Asia 2025 Shanghai Exhibition: Empowering the Future of Power Electronics with High-Performance Materials
From September 24 to 26, 2025, PCIM Asia Shanghai, the premier event in Asia’s power electronics industry—a leading international exhibition and conference on power components and renewable energy management—will be held grandly at Halls N4 and N5 of the Shanghai New International Expo Center.
2025
09-28
2025 Shanghai PCIM: Shenghua Microelectronics looks forward to your visit!
07-05
Explore the future of chips, and together build the dream of materials science! Central South University's materials students successfully concluded their 2025 Ascension Internship Program!
In the scorching heat of July, enthusiasm was blazing! On July 4, Changsha Shenghua Microelectronics Materials Co., Ltd. welcomed a vibrant group of visitors—students from the Class of 2023 at the School of Materials Science and Engineering, Central South University! Filled with a deep passion for materials science and an unwavering desire for hands-on industry experience, they stepped into Shenghua, embarking on an immersive internship journey.
07-04
Changsha Shenghua Microelectronics Materials Co., Ltd. shines at the 2025 China Optoelectronics Expo in Shenzhen, leveraging high-performance electronic packaging materials to empower a new future for the optoelectronics industry.
From September 10 to 12, 2025, the 26th China International Optoelectronics Expo (CIOE)—China Optics Fair—bustled to life at the Shenzhen International Convention and Exhibition Center. As the largest and most influential industry event in the global optoelectronics sector, this year’s expo drew over 3,800 high-quality optoelectronic companies from around the world, spanning all eight core areas of the optoelectronics industry chain.
09-15
Diamond Copper Thermal Conductivity: Leading a New Era of Efficient Thermal Management
2024
12-06
Changsha Shenghua Microelectronics Shines at CIOE China Light Expo: Jointly Drawing a New Blueprint for the Optoelectronic Materials Industry!
On September 11, 2024, the 25th China International Optoelectronics Expo (CIOE China Optoelectronics Expo) grandly kicked off at the Shenzhen International Convention and Exhibition Center, a feast of optoelectronic technology officially opened.
09-12
[Exhibition] Changsha Sublimation Microelectronics Material Co., Ltd. Shines PCIM Asia 2024 Shenzhen International Convention and Exhibition Center
Changsha Sublimation Microelectronics Materials Co., Ltd. (hereinafter referred to as "Sublimation Microelectronics") shined at the PCIM Asia 2024 Exhibition in Shenzhen International Convention and Exhibition Center (Baoan New Hall) from August 28 to 30, 2024, showing the world Its excellent high-performance electronic packaging material technology.
08-29
Changsha Shenghua Microelectronics Staff Symposium: Listen to the voice and seek common development
On June 18, Changsha Shenghua Microelectronic Materials Co., Ltd. held the second employee symposium of the year in the coffee bar on the first floor of the new factory. The symposium was presided over by Li Bo, Minister of Human Resources, aiming to listen to the voices of employees, solve the problems encountered by employees in their work, and further enhance the cohesion and centripetal force of the company.
06-19
Concentrate on Development and Strive for Progress-Review of 2024 Team Expansion Activities of Changsha Sublimation Microelectronic Materials Co., Ltd.
In Changsha Sublimation Microelectronics Materials Co., Ltd., we firmly believe that the strength of the team is the core driving force to promote the development of the company. On April 20, 2024, we held a meaningful team development activity with the theme of "concentrating on development, forging ahead and composing a new chapter.
04-20