Changsha Saneway Electronic Materials to Showcase Advanced Electronic Packaging Solutions at FINE 2026 in Shanghai

Changsha Saneway Electronic Materials Co., Ltd. will participate in the upcoming Future Industry New Materials Exhibition (FINE 2026), held at the Shanghai New International Expo Centre from June 10 to 12, 2026. Industry professionals, partners, and technical experts are cordially invited to visit Booth N2B10 to explore the latest innovations in thermal management and electronic packaging design.

As a high-tech enterprise dedicated to the research, development, and manufacture of high-performance electronic packaging materials, Saneway has established a leading production base in China. Leveraging advanced processing technology and an academic partnership with Central South University, the company provides critical material solutions that support continuous technological evolution across key high-tech sectors.

During the three-day exhibition, technical representatives will be on-site to present a comprehensive portfolio of specialized materials, including Tungsten-Copper (W-Cu), Molybdenum-Copper (Mo-Cu), CMC (Cu/Mo/Cu), CPC (Cu/MoCu/Cu), and Diamond-Copper composites. These high-performance materials are engineered specifically to address demanding thermal dissipation and reliability requirements in applications such as microwave RF, optical communications, semiconductor lasers, and power semiconductors.

FINE 2026 serves as an excellent platform to discuss technical requirements, explore customized material configurations, and establish long-term collaborative partnerships. The team looks forward to welcoming visitors to Shanghai and discussing how these advanced material solutions can enhance next-generation electronic designs.

Exhibition Details:

Event: Future Industry New Materials Exhibition (FINE 2026)

Date: June 10–12, 2026

Venue: Halls N1–N4, Shanghai New International Expo Centre (SNIEC)

Booth Location: Hall N2, Booth N2B10

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