Changsha Shenghua Microelectronics – Diamond/Copper Composite Materials: A New Benchmark for High-Power Electronics Thermal Management

As electronic devices continue to evolve toward higher power density and greater integration, thermal management has become a critical factor affecting device performance and reliability. Changsha Shenghua Microelectronics Materials Co., Ltd. has developed advanced diamond/copper composite materials that combine exceptional thermal conductivity, controllable thermal expansion, excellent mechanical strength, and good electrical conductivity, making them an ideal solution for next-generation high-end thermal management applications.

1. Product Specifications and Microstructure

The diamond/copper composite material features a uniform and dense microstructure, effectively leveraging the ultra-high thermal conductivity of diamond and the excellent ductility of copper. With stable material structure and strong interfacial bonding, it is well suited for high-power electronic packaging, lasers, RF devices, and other applications requiring superior heat dissipation performance.

2. Outstanding Thermal Conductivity

The material delivers exceptional thermal performance, with a thermal diffusivity of 344.656 mm²/s and a thermal conductivity of up to 819 W/m·K. These values significantly exceed those of conventional thermal management materials such as aluminum and pure copper, enabling more efficient heat dissipation, lower operating temperatures, and extended device lifespan.

3. Thermal Conductivity Degradation Control

To address potential thermal conductivity degradation during long-term operation, Shenghua has optimized the interfacial bonding between diamond and copper. As demonstrated by the DC600 grade material, thermal conductivity degradation can be controlled within 5%, ensuring excellent stability and reliability under prolonged high-temperature conditions.

4. Thermal Expansion Performance

The DC600 diamond/copper composite exhibits excellent thermal expansion stability across a wide temperature range from 25°C to 800°C. Its coefficient of thermal expansion (CTE) closely matches that of semiconductor materials such as silicon and gallium arsenide, effectively reducing the risk of packaging failure caused by thermal stress.

5. Mechanical Strength

The material also demonstrates excellent flexural strength and mechanical reliability. The DC600 grade provides sufficient structural integrity to meet the demanding requirements of high-reliability packaging applications and performs well in environments subject to vibration, shock, and other challenging operating conditions.

6. Electrical Conductivity

In addition to its superior thermal characteristics, the diamond/copper composite maintains excellent electrical conductivity. Testing results for the DC600 material indicate that its conductivity meets the requirements of most power electronic devices, making it suitable for applications requiring both thermal and electrical performance.

7. Machining Capabilities

The material offers excellent machinability and manufacturing flexibility. Shenghua provides customized processing services capable of producing components in various sizes, shapes, and precision levels to satisfy diverse packaging and system design requirements.

8. Surface Plating Capabilities

To enhance solderability, corrosion resistance, and interface compatibility, Shenghua offers comprehensive surface plating solutions. Depending on application requirements, different metal coatings such as nickel, gold, and silver can be applied to further improve the engineering performance of the material.

9. Technological Innovation and Patents

Shenghua continues to innovate in the areas of diamond/copper composite fabrication, interface engineering, and performance optimization. The company has filed three invention patents, with one already granted, establishing a core technology portfolio supported by independent intellectual property rights.

10. Technical Certification and Standards Development

The technology has been evaluated by authoritative organizations and recognized as reaching the international advanced level. In addition, Shenghua actively participates in industry standardization efforts and contributes to the development of group standards related to diamond/copper composite materials, helping promote high-quality industry growth.

Conclusion

With its ultra-high thermal conductivity, low thermal expansion coefficient, excellent mechanical and electrical properties, and superior machining and plating capabilities, Changsha Shenghua Microelectronics’ diamond/copper composite material has become a key material choice for high-power electronic packaging applications. Moving forward, the company will continue to drive technological innovation and industrialization, supporting the advancement of high-end thermal management materials toward the forefront of the global market.

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