Changsha Sublimation Microelectronics Material Co., Ltd.

Molybdenum Copper Material

Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. However, the density of molybdenum copper is much smaller than that of tungsten copper, making it more suitable for aerospace and other fields.

Classification:

Molybdenum Copper Series

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Product Introduction

Feature Of Product

1、No sintering activation elements such as Fe and Co are added to maintain high thermal conductivity

2、Excellent air tightness

3、Smaller density, more suitable for flight electronic equipment

4、Rolled plates can be provided to facilitate stamping parts

5、Provide semi-finished products or finished products with Ni/Au coating on the surface

Molybdenum Copper Material Properties

Material	Product Name	Component	Average linear expansion coefficient ［ppm/K］ Room temperature～400℃	Thermal conductivity ［W/(m·k)］	Mass Density ［g/cm³］	Relative Density ［%T.D.］
Mo-Cu	Mo85	Mo85Cu15	6.0 ～7.0	≥140	10.0±0.2	≥99
	Mo80	Mo80Cu20	6.5 ～7.5	≥150	9.9±0.2	≥99
	Mo70	Mo70Cu30	6.7 ～8.2	≥170	9.7±0.2	≥99
	Mo65	Mo65Cu35	7.8 ～9.3	≥180	9.65±0.2	≥99
	Mo60	Mo60Cu40	8.5 ～9.5	≥190	9.6±0.2	≥99
	Mo55	Mo55Cu45	10.5～11.5	≥200	9.55±0.2	≥99
	Mo50	Mo50Cu50	10.5～11.5	≥200	9.5±0.2	≥99

Molybdenum Copper Material combines excellent thermal conductivity with a low thermal expansion coefficient, making it ideal for electronics, aerospace, and semiconductor applications. It ensures stable performance under demanding conditions.

With outstanding heat dissipation, dimensional stability, and OEM customization, it reduces thermal stress, improves product reliability, and extends service life.

One electronics manufacturer upgraded to Molybdenum Copper Material for critical heat management. The result was higher operating stability, fewer failures, and lower maintenance costs, solving key challenges in precision manufacturing.

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