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Company News

Industry News

2020

2020

The company has successfully restructured and deepen reform nickel plating technology on the surface of heat sink materials, solving the problem of poor soldering of chip carriers. The nickel plating process has been improved and optimized

08

2023

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12

2015

2015

Diamond-copper, KCK and other products have been successfully developed

08

2023

/

12

2013

2013

The company moved to Ningxiang base

08

2023

/

12

2007

2007

Independently develop processing technology while improving industrial chain and surface treatment technology of electronic packaging materials

08

2023

/

12

2002

2002

Develop molybdenum copper, CMC (Cu/Mo/Cu) and CPC (Cu/MoCu/Cu) products

08

2023

/

12

2000

2000

Incorporation of the company

08

2023

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12

1999

1999

Develop tungsten copper electronic packaging materials

08

2023

/

12

Introduction of high-activity composite powder products

Introduction of high-activity composite powder products

Our company has prepared a kind of high-activity composite powder through the spray granulation method, which is characterized by its extremely high sintering shrinkage performance. It is often used in the production of thermal sink materials with large differences in melting points, such as tungsten-copper and molybdenum-copper metal powder mixed powder billet pressing, injection molding and other production processes.

08

2023

/

12

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