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Microwave Radio Frequency (RF)

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Semiconductor Laser

Kovar Coated by Silver-Copper Material

Kovar Coated by Silver-Copper Material

Kovar alloy, owing to its lower coefficient of thermal expansion, exhibits excellent thermal compatibility with ceramics and chip materials. It is commonly employed as the raw material for lead frames in electronic device packaging. Kovar is typically joined with other materials using silver-copper solder at temperatures exceeding 800 degrees Celsius. Kovar coated by silver-copper materials prefabricate silver-copper solder on the surface of Kovar, allowing for precise control over the composition, quantity, and shape of the solder. This approach helps mitigate errors and costs associated with manually attaching solder elements.

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Highly Active Composite Powder Products

Highly Active Composite Powder Products

Our company has developed a highly active composite powder, which has high sintering shrinkage performance. It is often used in the production of heat sink materials with large melting point difference, such as mixed powder of tungsten copper and molybdenum copper metal powders for press forming, injection molding and other production processes. Unlike traditional powders, our composite powder is closely bonded at the molecular level in the compound stage.

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Power Semiconductor

Power Semiconductor

Power semiconductor devices are widely used in motor drive, charging pile, photovoltaic wind power generation and other fields of current control and conversion. Power semiconductor devices have a certain on-resistance and switching loss during the turn-on and turn-off process, which will generate a lot of heat. In order to ensure the normal operation of the power module, tungsten copper, molybdenum copper and their composite materials can be used as the base plate material of the power module to reduce the mismatch with the thermal expansion coefficient of the ceramic substrate, and can also be used as the spacer and lead frame in the double-sided heat dissipation module to improve the heat dissipation capacity of the chip and improve the efficiency and reliability of the entire power electronic system.

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Microwave Radio Frequency (RF)

Microwave Radio Frequency (RF)

Microwave amplifiers, power amplifiers, RF integrated circuits and other devices commonly used in microwave RF are usually operated in a high power and high frequency state, and a large amount of heat is generated in the process, which may cause the chip to overheat and reduce the performance and reliability. Tungsten copper, molybdenum copper, CPC and other metal heat sink materials have high thermal conductivity and low thermal expansion coefficient, can be directly welded with the chip, effectively transfer the heat to the heat dissipation system, so as to maintain the stable working state of the device.

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SAF Coolest v1.2 设置面板FAUSX-AVRN-GZXAE-AVZ

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