Changsha Sublimation Microelectronics Material Co., Ltd.

Copper Molybdenum Copper Material

Copper/molybdenum/copper (CMC) is a composite material with a core made of metal molybdenum and coated on both sides with pure copper, forming a "sandwich" structure. CMC can be characterized as a material with adjustable properties based on the thickness ratio of copper and molybdenum metals. It exhibits high thermal conductivity, high strength, and a low coefficient of thermal expansion.This material finds applications as a heat sink and heat dissipation base for components such as radiofrequency tube casings and multilayer ceramics.

Classification:

Copper-Molybdenum-Copper Series

Key words:

Copper Molybdenum Copper Material oem

Product Introduction

Feature Of Product

1、Large area plates can be provided (length 400mm, width 200mm)

2、Can be punched into parts to reduce costs

3、High interface bonding strength and good thermal shock cycling resistance

4、Adjustable coefficient of thermal expansion to match the requirements of different materials such as semiconductors and ceramics

5、High thermal conductivity

6、Non-magnetic

Copper/molybdenum/copper Material Properties

Material	Product Name	Component	Average linear expansion coefficient in the plane direction ［ppm/K］ Room temperature～400℃	Thermal conductivity in the thickness direction ［W/(m·k)］	Mass Density ［g/cm³］
CMC	CMC111	Cu/Mo/Cu	8.8±0.5	>200	9.4±0.2
	CMC121		7.8±0.5	>190	9.6±0.2
	CMC131		6.8±0.5	>180	9.7±0.2
	CMC141		6.0±0.5	>170	9.8±0.2
	CMC-74		5.6±0.5	>160	9.9±0.2
CMC111 represents a Cu/Mo/Cu thickness ratio of 1:1:1, CMC-74 represents a Cu/Mo/Cu thickness ratio of 13:74:13

OEM Copper Molybdenum Copper Material spots deliver stable thermal solutions fast.

Key words:

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