Are heat sink materials and electronic packaging materials the same concept?

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No, they are not the same concept. Heat sink materials are specifically designed for use as heat sinks, while electronic packaging materials encompass a much broader range of materials, making it a larger concept. Some heat sink materials can be used for electronic packaging, but not all of them.

Electronic packaging materials encompass a wide range of materials, such as adhesive materials, aluminum-based, copper-based, and various other metal-based materials. Heat sink materials are specifically suitable for preparation using thermal spray deposition and should be considered as a subset of electronic packaging materials.