Changsha Sublimation Microelectronics Material Co., Ltd.
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Power Semiconductor

Microwave Radio Frequency (RF)

Optical Communication

Semiconductor Laser

Power Semiconductor

Power Semiconductor

Power semiconductor devices are widely used in motor drive, charging pile, photovoltaic wind power generation and other fields of current control and conversion. Power semiconductor devices have a certain on-resistance and switching loss during the turn-on and turn-off process, which will generate a lot of heat. In order to ensure the normal operation of the power module, tungsten copper, molybdenum copper and their composite materials can be used as the base plate material of the power module to reduce the mismatch with the thermal expansion coefficient of the ceramic substrate, and can also be used as the spacer and lead frame in the double-sided heat dissipation module to improve the heat dissipation capacity of the chip and improve the efficiency and reliability of the entire power electronic system.

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Microwave Radio Frequency (RF)

Microwave Radio Frequency (RF)

Microwave amplifiers, power amplifiers, RF integrated circuits and other devices commonly used in microwave RF are usually operated in a high power and high frequency state, and a large amount of heat is generated in the process, which may cause the chip to overheat and reduce the performance and reliability. Tungsten copper, molybdenum copper, CPC and other metal heat sink materials have high thermal conductivity and low thermal expansion coefficient, can be directly welded with the chip, effectively transfer the heat to the heat dissipation system, so as to maintain the stable working state of the device.

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Optical Communication

Optical Communication

In optical communication systems, laser diodes (LDs) and other optical components operate at high power for a long time. Metal materials such as tungsten and copper are usually used in the base of optical communication tube shells and other heat dissipation structures to effectively absorb and conduct the generated heat, maintain the optical performance of the optical communication system, prevent laser wavelength drift and communication efficiency reduction caused by chip temperature rise, and improve the stability of the communication system.

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Semiconductor Laser

Semiconductor Laser

Semiconductor lasers are widely used in medical, communications and industrial fields, but bar chips also generate a lot of heat while emitting light. As the heat dissipation base or transition heat sink of the semiconductor laser bar, the metal heat sink material such as tungsten copper has the characteristics of low thermal expansion coefficient and high thermal conductivity. Whether it is soldering or brazing, the bar and the heat sink have good matching, small smile effect, can achieve good heat dissipation, keep the bar running in a stable temperature range, prevent the laser from reducing performance or shortening life due to overheating, and improve the stability and consistency of its output.

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Dedicated to provide customers with quality products and timely and thoughtful service

  • Home

  • About

    • Company Profile

    • Enterprise Culture

    • Development Process

    • Honor Qualification

    • Company Environment

  • Product

    • Product Center

      • Tungsten Copper Material

      • Molybdenum Copper Material

      • Copper Molybdenum Copper Material

      • Diamond Metal Matrix Composites

      • Copper/Molybdenum-Copper/Copper Materials

      • Dispersion-Strengthened Copper Material

      • Copper Aluminum Composite Strip/Bonding Sheet Material

      • Kovar/Copper/Kovar(Kck) Composite Material

      • Other

      • Electroplating Service

    • Service Area

      • Microwave RF

      • Optical Communication

      • Semiconductor Laser

      • Power Semiconductor

  • Technology

    • Sample Application

  • News

    • Company News

    • Industry News

  • Contact Us

Contact Information

Sales Hotline:0731-83978608

Phone:18817146090(Same number on WeChat)
E-mail:junzhou@saneway.com

Enterprise address: No. 435, Section 3, jinzhou Avenue, Ningxiang High-tech Zone, Changsha

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