08

2023

-

12

2020

The company has successfully restructured and deepen reform nickel plating technology on the surface of heat sink materials, solving the problem of poor soldering of chip carriers. The nickel plating process has been improved and optimized


The company has successfully restructured and deepen reform nickel plating technology on the surface of heat sink materials, solving the problem of poor soldering of chip carriers. The nickel plating process has been improved and optimized

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