Changsha Saneway to Showcase Advanced Electronic Packaging Materials at Data Center Liquid Cooling Expo 2026

Changsha Saneway Electronic Materials Co., Ltd. will participate in the upcoming 6th Shenzhen International Data Center and Liquid Cooling Technology Exhibition. The event takes place from June 10th to 12th, 2026, at the Shenzhen World Exhibition & Convention Center.

As data centers and high-performance computing continue to push the boundaries of power density, efficient thermal management has become a critical priority for the industry. Changsha Saneway specialized in developing and manufacturing high-performance electronic packaging materials designed to meet these demanding thermal challenges. At the exhibition, the company will present its core product lineup, including tungsten-copper, molybdenum-copper, CMC (Cu/Mo/Cu), CPC (Cu/MoCu/Cu), and diamond-copper materials.

Leveraging advanced preparation technologies and a robust research foundation from its partnership with Central South University, Changsha Saneway provides essential materials that support reliable heat dissipation in microwave RF, optical communications, semiconductor lasers, and power semiconductors.

Industry professionals, partners, and attendees are invited to visit Booth N5.5146 in Hall 14 to explore these thermal management solutions and discuss potential collaborations.

Event Details:

Exhibition: The 6th Shenzhen International Data Center & Liquid Cooling Technology Exhibition

Date: June 10–12, 2026

Venue: Hall 14, Shenzhen World Exhibition & Convention Center

Booth Number: N5.5146

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